| D.E.H.™ 81 | Univar Solutions | D.E.H.™ 81 is a phenolic curing agent of intermediate reactivity containing curing catalyst as well as a polyacrylate flow modifier. The intermediate reactivity makes D.E.H.™ 81 particularly suitable as a starting base for product development. | Request Sample |
| D.E.H.™ 82 | Univar Solutions | D.E.H.™ 82 is a high reactivity phenolic curing agent containing curing catalyst as well as a polyacrylate flow modifier. Can be formulated in low temperature applications in combination with D.E.R.™ 6615 solid epoxy resin. | Request Sample |
| D.E.H.™ 84 | Univar Solutions | D.E.H.™ 84 is a curing agent based on an unmodified solid reaction product of liquid epoxy resin and bisphenol A containing about 2% of a curing accelerator. | Request Sample |
| D.E.H.™ 85 | Univar Solutions | D.E.H.™ 85 is a phenolic hardener based on an unmodified solid reaction product of liquid epoxy resin and bisphenol A. | Request Sample |
| D.E.H.™ 87 | Univar Solutions | D.E.H.™ 87 is a higher molecular weight curing agent based on an unmodified solid reaction product of liquid epoxy resin and bisphenol A. Designed primarily for functional powder coating applications requiring a high degree of flexibility and a good stora...Vea Mas D.E.H.™ 87 is a higher molecular weight curing agent based on an unmodified solid reaction product of liquid epoxy resin and bisphenol A. Designed primarily for functional powder coating applications requiring a high degree of flexibility and a good storage stability. Vea Menos | Request Sample |
| D.E.H.™ 90 | Univar Solutions | D.E.H.™ 90 is a solid reaction product of liquid epoxy resin and polyphenols containing polyacrylate flow modifier and 2% curing accelerator. Designed for powder coating applications that require fast cure capability and low curing temperature, combined w...Vea Mas D.E.H.™ 90 is a solid reaction product of liquid epoxy resin and polyphenols containing polyacrylate flow modifier and 2% curing accelerator. Designed for powder coating applications that require fast cure capability and low curing temperature, combined with superior adhesion property to metal substrates. Fully compatible with other D.E.H.™ 80 series epoxy curing agents. Vea Menos | Request Sample |
