Epoxies, Etc. is a leading resin formulator of epoxies, urethanes, and silicones. They take great pride in their commitment to the research, innovative development, and consistent manufacturing of materials for today's demanding applications. Epoxies, Etc.'s adhesives are widely used in the paint and coating industry for use in electronic, electrical, construction, and decorative industries.
Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent...Vea Mas
Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent electrical insulation properties. 20-1634 is formulated without solvents or other toxic materials. As a result, no by-products are released during the cure process and it is safe to handle. Vea Menos
Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenien...Vea Mas
Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenient 2:1 mix ratio. 20-3236 Resin can also be used for the encapsulation of vinyl insulated electrical components or sealing vinyl lead wires. Vea Menos
Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with ...Vea Mas
Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with an extended pot life and has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Well suited for high voltage applications. Vea Menos
Epoxies® 20-1710 is a two part, potting and encapsulating clear silicone gel that has a soft and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide ...Vea Mas
Epoxies® 20-1710 is a two part, potting and encapsulating clear silicone gel that has a soft and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1710 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. Vea Menos
Epoxies® 20-1715 is a two part, potting and encapsulating clear silicone gel that has a firm and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide ...Vea Mas
Epoxies® 20-1715 is a two part, potting and encapsulating clear silicone gel that has a firm and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1715 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. Vea Menos
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