| Ancorante PVC | Ichemco | Ancorante PVC is an additive for PVC adhesive tape printing inks. This product is most commonly used to improve ink transfer properties to the adhesive side of PVC tapes. | |
| Antiox 2246 | Ichemco | Antiox 2246 is a phenolic antioxidant. This product has a melting range of greater than 125°C. Antiox 2246 is most commonly used as an antioxidant in solvent-based adhesive applications. | |
| Antiox AHM | Ichemco | Antiox AHM is a blend of primary phenolic, thio-ester, and phosphite antioxidants. This product has a total solids content of 98-100% and a melting range of 110-140°C. Antiox AHM is most commonly used as an antioxidant in pressure sensitive adhesive and c...view more Antiox AHM is a blend of primary phenolic, thio-ester, and phosphite antioxidants. This product has a total solids content of 98-100% and a melting range of 110-140°C. Antiox AHM is most commonly used as an antioxidant in pressure sensitive adhesive and coating applications. view less | |
| Antiox AHM-EC Pellets | Ichemco | Antiox AHM-EC Pellets are a blend of four non-staining antioxidants. This product has a total solids content of 98-100%. Antiox AHM-EC Pellets are most commonly used as a UV protector in pressure sensitive adhesive and coating applications. | |
| Antiox LX | Ichemco | Antiox LX is a blend of a phenolic stabilizer, a thio-ester, and a phosphite antioxidant. This product has a total solids content of 98-100% and a Brookfield viscosity at 25°C of 50-200 mPa.s. Antiox LX is most commonly used as an antioxidant in natural r...view more Antiox LX is a blend of a phenolic stabilizer, a thio-ester, and a phosphite antioxidant. This product has a total solids content of 98-100% and a Brookfield viscosity at 25°C of 50-200 mPa.s. Antiox LX is most commonly used as an antioxidant in natural rubber, SBR, and resin adhesive applications. view less | |
| Antischiuma FL5 | Ichemco | Antischiuma FL5 is a VOC-free, organic defoamer. This product has a Brookfield viscosity at 25°C of 200-500 mPa.s. Antischiuma FL5 is most commonly used as a defoaming agent in water-based adhesive production applications. | |
| Curing Agent AQ 40 | Ichemco | Curing Agent AQ 40 is an aqueous dispersion of an isocyanate dimer. This product is recommended for the crosslinking of acrylic and polyurethane dispersions in a wide range of applications: adhesives, stickers, P.S.A. and for many more applications like ...view more Curing Agent AQ 40 is an aqueous dispersion of an isocyanate dimer. This product is recommended for the crosslinking of acrylic and polyurethane dispersions in a wide range of applications: adhesives, stickers, P.S.A. and for many more applications like protective films, binders for the leather finishing and coatings. view less | |
| Curing Agent ASB | Ichemco | Curing Agent ASB is a metallorganic compound solution. This product has a total solids content of 5.5-6.5%. Curing Agent ASB is most commonly used as a curing and cross-linking agent in solvent-based acrylic adhesive applications. | |
| Curing Agent MDI | Ichemco | Curing Agent MDI is a polyisocyanate in a liquid form. This product is most commonly used as a curing and cross-linking agent in solvent-based primer and adhesive applications. | |
| Curing Agent RF/AE | Ichemco | Curing Agent RF/AE is a polyisocyanate in a liquid solution form. This product has a total solids content of 25-29%. Curing Agent RF/AE is most commonly used in two-component primer and pressure sensitive adhesive applications. | |
| Curing agent RF/AE DE | Ichemco | Curing agent RF/AE DE is a polyisocyanate in a liquid solution form. This product has a total solids content of 25-27%. Curing agent RF/AE DE is most commonly used in two-component primer and pressure sensitive adhesive applications. | |
| Curing Agent V3 | Ichemco | Curing Agent V3 is a curing agent formulated specifically for use in Primer SIL 30 applications. This product has a total solids content of 49-51% and a Brookfield viscosity at 25°C of less than 10 mPa.s. Curing Agent V3 increases silicon adhesive ancho...view more Curing Agent V3 is a curing agent formulated specifically for use in Primer SIL 30 applications. This product has a total solids content of 49-51% and a Brookfield viscosity at 25°C of less than 10 mPa.s. Curing Agent V3 increases silicon adhesive anchorage to substrates where Primer SIL 30 has been applied. view less | |
| Curing Agent V4 | Ichemco | Curing Agent V4 is a curing agent formulated specifically for use in Primer SIL 30 applications. This product has a total solids content of 99-100% and a Brookfield viscosity at 25°C of 20-30 mPa.s. Curing Agent V4 increases silicon adhesive anchorage t...view more Curing Agent V4 is a curing agent formulated specifically for use in Primer SIL 30 applications. This product has a total solids content of 99-100% and a Brookfield viscosity at 25°C of 20-30 mPa.s. Curing Agent V4 increases silicon adhesive anchorage to substrates where Primer SIL 30 has been applied. view less | |
| Curing Agent W 9 | Ichemco | Curing Agent W 9 is a liquid polyisocyanate. This product has a total solids content of 79-81%. Curing Agent W 9 is most commonly used as a curing and cross-linking agent in water-based adhesive, varnish, and lacquer applications. | |
| Curing Agent W3 | Ichemco | Curing Agent W3 is a liquid polyisocyanate. This product has a Brookfield viscosity at 25°C of 1500-3500 mPa.s. Curing Agent W3 is most commonly used to increase heat, water, plasticizer, and organic solvent resistance in coating, adhesive, and leather fi...view more Curing Agent W3 is a liquid polyisocyanate. This product has a Brookfield viscosity at 25°C of 1500-3500 mPa.s. Curing Agent W3 is most commonly used to increase heat, water, plasticizer, and organic solvent resistance in coating, adhesive, and leather finishing applications. view less | |
| Curing Agent W3 DIL | Ichemco | Curing Agent W3 DIL is a water-dispersable polyisocyanate. This product has a total solids content of 69-71%. Curing Agent W3 DIL is most commonly used as a curing and cross-linking agent in adhesive, paint, and lacquer applications. | |
| Defoamer FL 1 Conc. | Ichemco | Defoamer FL 1 Conc. is a non-siliconic, organic defoamer. This product has a Brookfield viscosity at 25°C of 500-1500 mPa.s. Defoamer FL 1 Conc. is most commonly used as a defoaming agent in water-based paint, plaster, and adhesive emulsion applications. | |
| Defoamer FL 9 | Ichemco | Defoamer FL 9 is a defoaming emulsion based on organo-modified siloxanes. This product has a total solids content of 24-28% and a Brookfield viscosity at 25°C of 220-620 mPa.s. Defoamer FL 9 is most commonly used as a defoaming agent in pressure sensitive...view more Defoamer FL 9 is a defoaming emulsion based on organo-modified siloxanes. This product has a total solids content of 24-28% and a Brookfield viscosity at 25°C of 220-620 mPa.s. Defoamer FL 9 is most commonly used as a defoaming agent in pressure sensitive adhesive applications. view less | |
| Release FR 100 | Ichemco | Release FR 100 is a vegetable oil, release agent, and polyamidic resin-based compound. This product has a total solids content of 98-100%. Release FR 100 is most commonly used in PS adhesive tape and film productions applications. | |
| Release FR 100 V | Ichemco | Release FR 100 V is a release agent. This product has a total solids content of 99-100%. Release FR 100 V is most commonly used in PE and aluminum tape production applications. | |
| Release FR 2 AB | Ichemco | Release FR 2 AB is a vegetable oil, release agent, and polyamidic resin-based compound in a hydrocarbon solvent solution. This product has a total solids content of 4.5-5.5%. Release FR 2 AB is most commonly used as a release agent in PS adhesive tape a...view more Release FR 2 AB is a vegetable oil, release agent, and polyamidic resin-based compound in a hydrocarbon solvent solution. This product has a total solids content of 4.5-5.5%. Release FR 2 AB is most commonly used as a release agent in PS adhesive tape and film production applications. view less | |
| Release FR 5 C | Ichemco | Release FR 5 C is an additive and release agent-based compound in a toluene solution. This product has a total solids content of 4-6%. Release FR 5 C is most commonly used as a release agent in PS adhesive tape and film production applications. | |
| Release K 100 D DIL.2 | Ichemco | Release K 100 D DIL.2 is a polyvinylcarbonate release agent in a toluene solvent solution. This product has a total solids content of 1.8-2.2%. Release K 100 D DIL.2 is most commonly used in adhesive tape production applications. | |
| Release K 100 DI DIL. 1 ECO | Ichemco | Release K 100 DI DIL. 1 ECO is a polyvinylcarbamate release agent in an aliphatic and isopropyl alcohol solvent solution. This product has a total solids content of 0.9-1.1%. Release K 100 DI DIL. 1 ECO is most commonly used as a release agent in adhesive...view more Release K 100 DI DIL. 1 ECO is a polyvinylcarbamate release agent in an aliphatic and isopropyl alcohol solvent solution. This product has a total solids content of 0.9-1.1%. Release K 100 DI DIL. 1 ECO is most commonly used as a release agent in adhesive tape production applications. view less | |
| Release K 100 DI DIL. 1.5 ECO | Ichemco | Release K 100 DI DIL. 1.5 ECO is a polyvinylcarbamate release agent in an aliphatic and isopropyl alcohol solvent solution. This product has a total solids content of 1.4-1.6%. Release K 100 DI DIL. 1.5 ECO is most commonly used as a release agent in adhe...view more Release K 100 DI DIL. 1.5 ECO is a polyvinylcarbamate release agent in an aliphatic and isopropyl alcohol solvent solution. This product has a total solids content of 1.4-1.6%. Release K 100 DI DIL. 1.5 ECO is most commonly used as a release agent in adhesive tape production applications. view less | |
| Release K 100 DM | Ichemco | Release K 100 DM is a polyvinylcarbamate is a synthetic polymer with a high molecular weight. This product has a total solids content of 98-100% and a melting range 75-85°C. Release K 100 DM is most commonly used as a release agent in acrylic adhesive, as...view more Release K 100 DM is a polyvinylcarbamate is a synthetic polymer with a high molecular weight. This product has a total solids content of 98-100% and a melting range 75-85°C. Release K 100 DM is most commonly used as a release agent in acrylic adhesive, as well as corona and non corona-treated film coating applications. view less | |
| Release PP 100 | Ichemco | Release PP 100 is a synthetic polymer. This product has a total solids content of 98-100% and a melting point of 83-93°C. Release PP 100 is most commonly used as a release agent in low-noise OPP adhesive tape printing applications. | |
| Release PP 25 | Ichemco | Release PP 25 is a synthetic polymer in a solvent solution. This product has a total solids content of 22-24% and a melting range of 90-115°C. Release PP 25 is most commonly used as a release agent in adhesive tape printing applications. | |
| Release W 40 G2 | Ichemco | Release W 40 G2 is a water-based release agent. This product has a total solids content of 38-40% and a Brookfield viscosity at 25°C of 150-450 mPa.s. Release W 40 G2 is most commonly used as a release agent in hot-melt and solventborne adhesive applicati...view more Release W 40 G2 is a water-based release agent. This product has a total solids content of 38-40% and a Brookfield viscosity at 25°C of 150-450 mPa.s. Release W 40 G2 is most commonly used as a release agent in hot-melt and solventborne adhesive applications. view less | |
| Release W 40 GB4 LV | Ichemco | Release W 40 GB4 LV is a water-based release agent. This product has a total solids content of 38-40% and a Brookfield viscosity at 25°C of 30-100 mPa.s. Release W 40 GB4 LV is most commonly used as a release agent in hot-melt adhesive and porous substrat...view more Release W 40 GB4 LV is a water-based release agent. This product has a total solids content of 38-40% and a Brookfield viscosity at 25°C of 30-100 mPa.s. Release W 40 GB4 LV is most commonly used as a release agent in hot-melt adhesive and porous substrate coating applications. view less | |
| Release W 45 GB 15 | Ichemco | Release W 45 GB 15 is a water-based release agent based on acrylic polymers. This product has a total solids content of 44-46% and a Brookfield viscosity at 25°C of less than 500 mPa.s. Release W 45 GB 15 is most commonly used as a release agent in hot-me...view more Release W 45 GB 15 is a water-based release agent based on acrylic polymers. This product has a total solids content of 44-46% and a Brookfield viscosity at 25°C of less than 500 mPa.s. Release W 45 GB 15 is most commonly used as a release agent in hot-melt and solventborne adhesive applications. view less | |
| Release W 45 GB 5 | Ichemco | Release W 45 GB 5 is a water-based release agent based on acrylic polymers. This product has a total solids content of 44-46% and a Brookfield viscosity at 25°C of 500-1500 mPa.s. Release W 45 GB 5 is most commonly used as a controlled release agent in ho...view more Release W 45 GB 5 is a water-based release agent based on acrylic polymers. This product has a total solids content of 44-46% and a Brookfield viscosity at 25°C of 500-1500 mPa.s. Release W 45 GB 5 is most commonly used as a controlled release agent in hot-melt adhesive applications. view less | |
| Release W 45 GS 15 | Ichemco | Release W 45 GS 15 is a water-based release agent based on acrylic polymers. This product has a total solids content of 44-46% and a Brookfield viscosity at 25°C of less than 500 mPa.s. Release W 45 GS 15 is most commonly used as a release agent in hot-me...view more Release W 45 GS 15 is a water-based release agent based on acrylic polymers. This product has a total solids content of 44-46% and a Brookfield viscosity at 25°C of less than 500 mPa.s. Release W 45 GS 15 is most commonly used as a release agent in hot-melt and solventborne adhesive applications. view less | |
| Release W40 GB1 | Ichemco | Release W40 GB1 is a water-based release agent based on acrylic polymers. This product has a total solids content of 39-41% and a Brookfield viscosity at 25°C of 800-1200 mPa.s. Release W40 GB1 is most commonly used as a release agent in hot-melt and so...view more Release W40 GB1 is a water-based release agent based on acrylic polymers. This product has a total solids content of 39-41% and a Brookfield viscosity at 25°C of 800-1200 mPa.s. Release W40 GB1 is most commonly used as a release agent in hot-melt and solvent-based adhesive, as well as porous substrate coating applications. view less | |
| Release W40 GB1 LV | Ichemco | Release W40 GB1 LV is a water-based release agent based on acrylic polymers. This product has a total solids content of 39-41% and a Brookfield viscosity at 25°C of 30-70 mPa.s. Release W40 GB1 LV is most commonly used as a release agent in hot-melt and s...view more Release W40 GB1 LV is a water-based release agent based on acrylic polymers. This product has a total solids content of 39-41% and a Brookfield viscosity at 25°C of 30-70 mPa.s. Release W40 GB1 LV is most commonly used as a release agent in hot-melt and solvent-based adhesive, as well as porous substrate coating applications. view less | |
| Release W40 GB2 | Ichemco | Release W40 GB2 is a water-based release agent based on acrylic polymers. This product has a total solids content of 39-41%, a pH level of 8-9, and a Brookfield viscosity at 25°C of 800-1200 mPa.s. Release Release W40 GB2 is most commonly used as a releas...view more Release W40 GB2 is a water-based release agent based on acrylic polymers. This product has a total solids content of 39-41%, a pH level of 8-9, and a Brookfield viscosity at 25°C of 800-1200 mPa.s. Release Release W40 GB2 is most commonly used as a release agent in hot-melt and solvent-based adhesive, as well as porous substrate coating applications. view less | |
| Release W40 GB3 | Ichemco | Release W40 GB3 is a water-based release agent based on acrylic polymers. This product has a total solids content of 39-41%, a pH of 7-9, and a Brookfield viscosity at 25°C of 800-1200 mPa.s. Release W40 GB3 is most commonly used as a release agent in sub...view more Release W40 GB3 is a water-based release agent based on acrylic polymers. This product has a total solids content of 39-41%, a pH of 7-9, and a Brookfield viscosity at 25°C of 800-1200 mPa.s. Release W40 GB3 is most commonly used as a release agent in substrate coatings where contact with hot-melt and solvent-based adhesives is common. view less | |
| Release W40 GB6 LV | Ichemco | Release W40 GB6 LV is a water-based release agent based on acrylic polymers. This product has a total solids content of 39-41%, a pH of 8-9, and a Brookfield viscosity at 25°C of 30-70 mPa.s. Release W40 GB6 LV is most commonly used as a release agent in ...view more Release W40 GB6 LV is a water-based release agent based on acrylic polymers. This product has a total solids content of 39-41%, a pH of 8-9, and a Brookfield viscosity at 25°C of 30-70 mPa.s. Release W40 GB6 LV is most commonly used as a release agent in hot-melt and solvent-based adhesive, as well as porous substrate coating applications. view less | |
| Release WF 30 | Ichemco | Release WF 30 is a water-based release agent based on acrylic polymers. This product has a total solids content of 29-31%, a pH of 3-5, and a Brookfield viscosity at 25°C of 20-70 mPa.s. Release WF 30 is most commonly used as a release agent in technical ...view more Release WF 30 is a water-based release agent based on acrylic polymers. This product has a total solids content of 29-31%, a pH of 3-5, and a Brookfield viscosity at 25°C of 20-70 mPa.s. Release WF 30 is most commonly used as a release agent in technical tape applications. view less |
