| Epokukdo KDCP-200 | Kukdo Chemical Co., Ltd. | Epokukdo KDCP-200 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advanta...展開 Epokukdo KDCP-200 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation epoxy resins, such as o-cresol novolac epoxy resin(YDCN type) or biphenyl type epoxy resin. This product can be substituted for YDCN and biphenyl type epoxy resin for preparing EMC with excellent performance in SMD. 收起 | |
| Epokukdo KDCP-150 | Kukdo Chemical Co., Ltd. | Epokukdo KDCP-150 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advanta...展開 Epokukdo KDCP-150 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation epoxy resins, such as o-cresol novolac epoxy resin(YDCN type) or biphenyl type epoxy resin. This product can be substituted for YDCN and biphenyl type epoxy resin for preparing EMC with excellent performance in SMD. 收起 | |
| Epokukdo KDCP-100 | Kukdo Chemical Co., Ltd. | Epokukdo KDCP-100 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advanta...展開 Epokukdo KDCP-100 is a multi-functional epoxy resin derived from poly-addition compound of dicyclopentadiene and phenol, and is designed for application of high performance epoxy molding compound(EMC) in semi-conductor and laminates. The strongest advantage in semi-conductor packaging using this product is much lower moisture absorption than previous generation epoxy resins, such as o-cresol novolac epoxy resin(YDCN type) or biphenyl type epoxy resin. This product can be substituted for YDCN and biphenyl type epoxy resin for preparing EMC with excellent performance in SMD. 收起 | |
| Epokukdo YH-300 | Kukdo Chemical Co., Ltd. | Epokukdo YH-300, tri-functional epoxy resin which is a reactive diluent, provides very low viscosity, low temperature curable, non-crystalline, non-yellowing and low volatile content in combination with standard liquid epoxy resin such as Epokukdo YD-128....展開 Epokukdo YH-300, tri-functional epoxy resin which is a reactive diluent, provides very low viscosity, low temperature curable, non-crystalline, non-yellowing and low volatile content in combination with standard liquid epoxy resin such as Epokukdo YD-128. YH-300 is well suited for use in electrical insulation, tar epoxy coating, FRP, molding, etc. 收起 | |
| Epokukdo KDT-4400 | Kukdo Chemical Co., Ltd. | Epokukdo KDT-4400 is a tetra functional epoxy resin that shows excellent cured properties such as UV-blocking effect and thermal stability, etc. In case of being used with low brominated epoxy resin, it can be applied in electronic and electrical field fo...展開 Epokukdo KDT-4400 is a tetra functional epoxy resin that shows excellent cured properties such as UV-blocking effect and thermal stability, etc. In case of being used with low brominated epoxy resin, it can be applied in electronic and electrical field for AOI system. 收起 | |
| Epoxies® 50-3122 | Epoxies, Etc. | Epoxies® 50-3122 is a one part epoxy adhesive with both high sheer and high peel strength properties. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50-3122 is both a thermally conductive and electri...展開 Epoxies® 50-3122 is a one part epoxy adhesive with both high sheer and high peel strength properties. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50-3122 is both a thermally conductive and electrically insulating epoxy adhesive. It is suitable for electronic, electrical, aerospace, appliance, automotive and industrial applications. 收起 | |
| Epokukdo YDB-500A80 | Kukdo Chemical Co., Ltd. | Epokukdo YDB-500A80 is a low brominated epoxy resin that contains 19-20% of bromine content to give self-extinguishing property, and its solution type involves in 20% acetone of solvent content. It is suitable for making moldings, laminates, electrical an...展開 Epokukdo YDB-500A80 is a low brominated epoxy resin that contains 19-20% of bromine content to give self-extinguishing property, and its solution type involves in 20% acetone of solvent content. It is suitable for making moldings, laminates, electrical and electronic parts and printed circuit boards (PCB, because this product has flame retardant characteristics and dimensional stability like general epoxy resin. 收起 | |
| Epoxies® 50-3150 FR | Epoxies, Etc. | Epoxies® 50-3150 is a flame retardant, thermally conductive epoxy resin that has been formulated to meet the stringent non-burning requirements of UL94 V-0. It is a black epoxy mixed with catalyst 190 and catalyst 30 and offers great heat transfer, low sh...展開 Epoxies® 50-3150 is a flame retardant, thermally conductive epoxy resin that has been formulated to meet the stringent non-burning requirements of UL94 V-0. It is a black epoxy mixed with catalyst 190 and catalyst 30 and offers great heat transfer, low shrinkage, and outstanding insulation properties. Primarily used for encapsulating power supplies, transformers, coils, insulators, sensors, etc... Epoxies® 50-3150 FR is an excellent choice for applications requiring high thermal conductivity and flame retardancy. 收起 | |
| Epoxies® 20-3302 | Epoxies, Etc. | Epoxies® 20-3302 is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excel...展開 Epoxies® 20-3302 is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excellent optical transmission along with outstanding adhesion and electrical properties. 20-3302 is a low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring a bubble free and glass smooth finish with optimum clarity. 收起 | |
| Epoxies® 20-3302NCLV | Epoxies, Etc. | Epoxies® 20-3302NCLV is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides e...展開 Epoxies® 20-3302NCLV is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excellent optical transmission along with outstanding adhesion and electrical properties. 20-3302NCLV is a very low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring a bubble free and glass smooth finish with optimum clarity. 收起 | |
| Epoxies® 20-3068 | Epoxies, Etc. | Epoxies® 20-3068 is a two part epoxy adhesive and potting compound that can cure in room temperatures and has excellent chemical and corrosion resistance. This product provides good water resistance, adhesion, and toughness and is well suited for use with...展開 Epoxies® 20-3068 is a two part epoxy adhesive and potting compound that can cure in room temperatures and has excellent chemical and corrosion resistance. This product provides good water resistance, adhesion, and toughness and is well suited for use with most electronics. 20-3068 Epoxy System meets the Food and Drug Administration (FDA) regulations permitting use in “indirect” food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. 收起 | |
| Epokukdo KB-563P | Kukdo Chemical Co., Ltd. | Epokukdo KB-563P is a high-brominated flameretardant epoxy oligomer resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This epoxy oligomer resin shows excellent mechanical, electrica...展開 Epokukdo KB-563P is a high-brominated flameretardant epoxy oligomer resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This epoxy oligomer resin shows excellent mechanical, electrical properties, chemical resistance, molding property, heat resistance and melt flow-rate. In order to improve the flame retardancy, it can be used in engineering plastics such as ABS, HIPS, PP, PET, PC, PBT and so forth. 收起 | |
| Epokukdo KB-562P | Kukdo Chemical Co., Ltd. | Epokukdo KB-562P is a high-brominated flame-retardant epoxy oligomer Resin using TBBA and TBP asmajor raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrica...展開 Epokukdo KB-562P is a high-brominated flame-retardant epoxy oligomer Resin using TBBA and TBP asmajor raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrical properties, chemical resistance, molding property, heat resistance and melt flow-rate. In order to improve the flame retardancy, it can be used in engineering plastics such as ABS, HIPS, PP, PET, PC, PBT and so forth. 收起 | |
| Epokukdo KB-560 | Kukdo Chemical Co., Ltd. | Epokukdo KB-560 is a high-brominated flame-retardant Epoxy oligomer Resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrica...展開 Epokukdo KB-560 is a high-brominated flame-retardant Epoxy oligomer Resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrical properties, chemical resistance, molding property, heat resistance and melt flow-rate. In order to improve the flame retardancy, it can be used in engineering plastics such as ABS, HIPS, PP, PET, PC, PBT and so forth. 收起 | |
| Epoxies® 40-3905 | Epoxies, Etc. | Epoxies® 40-3905 is an electrically epoxy adhesive and coating system designed for applications requiring low temperature cures. It will cure at room temperature in 18-24 hours and can be accelerated with mild heat. Epoxies® 40-3905 is a solvent free epo...展開 Epoxies® 40-3905 is an electrically epoxy adhesive and coating system designed for applications requiring low temperature cures. It will cure at room temperature in 18-24 hours and can be accelerated with mild heat. Epoxies® 40-3905 is a solvent free epoxy filled with pure silver for improved electrical conduction and heat transfer. It has outstanding adhesion to plastics, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic, and printed circuit boards. 40-3905 can also be thinned with up to 10% Toluol for many coating applications. 收起 | |
| Epoxies® 20-3006 | Epoxies, Etc. | Epoxies® 20-3006 is a two part, flexible epoxy potting and encapsulating compound specially formulated to provide electrical insulation, chemical protection and thermal shock resistance. Its flexibility provides low stress on surface mounts and other deli...展開 Epoxies® 20-3006 is a two part, flexible epoxy potting and encapsulating compound specially formulated to provide electrical insulation, chemical protection and thermal shock resistance. Its flexibility provides low stress on surface mounts and other delicate electronic components. 20-3006 has an easy one to one mix ratio, and is D.O.T. non-hazardous. 收起 | |
| Epoxies® 20-3001 NC | Epoxies, Etc. | Epoxies® 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating resin which forms a bubble free glass like finish upon curing. It is either black or clear and dose not contain any solvents. with a 1 to 1 mix ratio and lack of fillers, it ...展開 Epoxies® 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating resin which forms a bubble free glass like finish upon curing. It is either black or clear and dose not contain any solvents. with a 1 to 1 mix ratio and lack of fillers, it is an ideal material for meter mixes and dispense equipment. 收起 | |
| Epoxies® 20-3035 | Epoxies, Etc. | Epoxies® 20-3035 is a low density, to part epoxy potting and encapsulating compound with half the weight of most commercially available potting compounds on the market. it exhibits low shrinkage during the cure process with a low coefficient of thermal ex...展開 Epoxies® 20-3035 is a low density, to part epoxy potting and encapsulating compound with half the weight of most commercially available potting compounds on the market. it exhibits low shrinkage during the cure process with a low coefficient of thermal expansion. 20-3035 is an ideal materail for the potting of electron assemblies where a low dielectric constant and low weight are required. 收起 | |
| Epoxies® 50-3100 | Epoxies, Etc. | Epoxies® 50-3100 is a high thermal K heat transfer epoxy resin designed for fast and continuous heat transfer. Primarily used for the encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc....展開 Epoxies® 50-3100 is a high thermal K heat transfer epoxy resin designed for fast and continuous heat transfer. Primarily used for the encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc. 50-3100 measures several times faster heat dissipation than other commercially available types and can be easily mixed and poured to form a dimensionally stable heat transfer package. 收起 | |
| Epoxies® 20-3300 | Epoxies, Etc. | Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with ...展開 Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with an extended pot life and has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Well suited for high voltage applications. 收起 | |
| Epokukdo KBPN-110 | Kukdo Chemical Co., Ltd. | Epokukdo KBPN-110 (BPA - Novolac Epoxy) has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional epoxy resin. KBP...展開 Epokukdo KBPN-110 (BPA - Novolac Epoxy) has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional epoxy resin. KBPN-110 is a small molecular type of KBPN series and is used for the product which requires the characteristics of heat resistance, chemical resistance and low temp erature curability, high Tg for powder coating or laminates. It also has high reactivity so that it is curable at ambient temperature. 收起 | |
| Epoxies® 50-3182 NC | Epoxies, Etc. | Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferr...展開 Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferring heat. 50-3182 NC is designed to work with a variety of catalysts to adjust additional properties including toughness, viscosity, thermal and mechanical shock values and cure times. This product is well suited for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc... 收起 | |
| Epoxies® 40-3909 | Epoxies, Etc. | Epoxies® 40-3909 is a two part epoxy resin adhesive and coating compound, filled with a highly conductive, silver coated nickel. It is designed to provide low volume resistivity of less than 5x10-3 ohm-cm. Silver coated nickel offers a lower cost alternat...展開 Epoxies® 40-3909 is a two part epoxy resin adhesive and coating compound, filled with a highly conductive, silver coated nickel. It is designed to provide low volume resistivity of less than 5x10-3 ohm-cm. Silver coated nickel offers a lower cost alternative to many silver filled epoxy systems. 40-3909 has a convenient 1:1 mix ratio by weight and can cure at room temperature overnight but can also be accelerated with mild heat. It is well suited for use in the assembly or repairs of printed circuit boards, connectors, wave guides, high frequency shields, and as a cold solder. 收起 | |
| Epokukdo YD-128S | Kukdo Chemical Co., Ltd. | Epokukdo YD-128S is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic...展開 Epokukdo YD-128S is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128S, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. 收起 | |
| Epokukdo YD-128 | Kukdo Chemical Co., Ltd. | Epokukdo YD-128 is a liquid type standard epoxy resin derived from Bisphenol-A. It has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128 is cured together with the various hardeners (polyamide resin, aromatic polyamine, alipha...展開 Epokukdo YD-128 is a liquid type standard epoxy resin derived from Bisphenol-A. It has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128 is cured together with the various hardeners (polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. 收起 | |
| Epotec® YD 127 FP | Aditya Birla | Epotec® YD 127 FP is an unmodified, low viscosity liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. This product is ideal for use in high solids solvent-free coatings, laminates, and electrical & electronics applications. | |
| Epoxies® 20-3060 | Epoxies, Etc. | Epoxies® 20-3060 is a low viscosity, general purpose, epoxy potting and encapsulating resin made from 100% solids and dose not contain any solvents. It has exceptional resistance to impact, vibration, and thermal shock. In addition, this versatile resin s...展開 Epoxies® 20-3060 is a low viscosity, general purpose, epoxy potting and encapsulating resin made from 100% solids and dose not contain any solvents. It has exceptional resistance to impact, vibration, and thermal shock. In addition, this versatile resin system is machinable and ideal for use with meter mix dispensing equipment. 20-3060 is recommended for applications requiring the optimum in over-all properties and where rigid or flexible wire leads protrude directly from the encapsulation. It also adheres extremely well to lead materials, such as vinyl, neoprene, natural rubber, etc. 收起 | |
| Epoxies® 50-3170 | Epoxies, Etc. | Epoxies® 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. The resin has a rubber consistency and retains its properties and f...展開 Epoxies® 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. The resin has a rubber consistency and retains its properties and flexibility on long term aging. This allows pottings and castings to be probed for detection of electrical failure. 50-3170 can be used for bonding sensitive components or for potting of power supplies, coils, glass diodes, and other delicate assemblies. This new formulation can be used successfully for transformers, regulators, PCB's, etc... 收起 | |
| Docure TH-437 | Kukdo Chemical Co., Ltd. | Docure TH-437 is an aromatic amine modified curing agent for use with epoxy resins. TH-437 has low viscosity and long pot life. It can be used for electrical tools, pottings and castings. | |
| Epoxies® 50-3186 NC | Epoxies, Etc. | Epoxies® 50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal e...展開 Epoxies® 50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance. 收起 | |
| Epoxies® 20-2521 | Epoxies, Etc. | Epoxies® 20-2521 is a black, two part, polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cy...展開 Epoxies® 20-2521 is a black, two part, polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. Epoxies® 20-2521 is also well known for its outstanding thermal shock and excellent dielectric properties. It is also a good choice when exposure to salt water, mild acids and bases, and aliphatic hydrocarbons is expected. 收起 | |
| Epoxies® 20-2523 | Epoxies, Etc. | Epoxies® 20-2523 is a black, two part, high performance polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throu...展開 Epoxies® 20-2523 is a black, two part, high performance polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. Epoxies® 20-2521 is also well known for its outstanding thermal shock and excellent dielectric properties. It is also a good choice when exposure to salt water, mild acids and bases, and aliphatic hydrocarbons is expected. 收起 | |
| Epokukdo YD-128SH | Kukdo Chemical Co., Ltd. | Epokukdo YD-128SH is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance etc. Epokukdo YD-128SH is cured together with the various hardeners(polyamide resin, aromatic pol...展開 Epokukdo YD-128SH is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance etc. Epokukdo YD-128SH is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128SH, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. 收起 | |
| Epokukdo YD-128SM | Kukdo Chemical Co., Ltd. | Epokukdo YD-128SM is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128SM is cured together with the various hardeners(polyamide resin, aromatic po...展開 Epokukdo YD-128SM is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128SM is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128SM, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. 收起 | |
| Epokukdo YD-128H | Kukdo Chemical Co., Ltd. | Epokukdo YD-128H is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128H is cured together with the various hardeners(polyamide resin, aromatic poly...展開 Epokukdo YD-128H is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128H is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128H, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. 收起 | |
| Epokukdo YD-128M | Kukdo Chemical Co., Ltd. | Epokukdo YD-128M is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128M is cured together with the various hardeners(polyamide resin, aromatic poly...展開 Epokukdo YD-128M is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128M is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128M, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. 收起 | |
| Epokukdo YD-128A | Kukdo Chemical Co., Ltd. | Epokukdo YD-128A is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128A is cured together with the various hardeners(polyamide resin, aromatic poly...展開 Epokukdo YD-128A is a liquid type standard epoxy resin derived from Bisphenol-A. Especially, it has excellent adhesion, chemical resistance, heat resistance, etc. Epokukdo YD-128A is cured together with the various hardeners(polyamide resin, aromatic polyamine, aliphatic polyamine and anhydride compound). Depending on diluents and other additives, different physical properties after curing can be obtained. Generally, YD-128A, clear liquid form of the standard epoxy resins is widely used in many fields such as paints, electrode paint, ambient curing paint, clear coating agent, anti-corrosion coatings, casting, dipping, encapsulation, laminates, condenser, resistor coating etc.. 收起 | |
| Epoxies® 20-2330 | Epoxies, Etc. | Epoxies® 20-2330 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...展開 Epoxies® 20-2330 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2330 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. 收起 | |
| Epoxies® 20-2345 | Epoxies, Etc. | Epoxies® 20-2345 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...展開 Epoxies® 20-2345 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2345 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. 收起 | |
| Epoxies® 20-2370 | Epoxies, Etc. | Epoxies® 20-2370 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...展開 Epoxies® 20-2370 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2370 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. 收起 | |
| Epoxies® 20-2390 | Epoxies, Etc. | Epoxies® 20-2390 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...展開 Epoxies® 20-2390 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2390 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. 收起 | |
| Domide G-A0533 | Kukdo Chemical Co., Ltd. | Domide G-A0533 is a low-viscosity Polyamidoamine Resin designed for reaction with liquid or solid Epoxy Resins. It can be used as all or part for use in making sealants, electrical potting, casting, coatings and flooring applications. | |
| Domide G-A0432 | Kukdo Chemical Co., Ltd. | Domide G-A0432 is a low viscosity Polyamidoamine Resin for reaction with liquid or solid Epoxy Resins. GA0432 is lower in viscosity than G-A0533. This product is well suited for use in sealants, electrical potting and casting. | |
| Epoxies® 20-1625 | Epoxies, Etc. | Epoxies® 20-1625 is a two part optically clear silicone potting and encapsulating compound with a low viscosity and easy 1:1 ratio system. 20-1625 is formulated without solvents or other toxic materials and provides good heat resistance and is flame retar...展開 Epoxies® 20-1625 is a two part optically clear silicone potting and encapsulating compound with a low viscosity and easy 1:1 ratio system. 20-1625 is formulated without solvents or other toxic materials and provides good heat resistance and is flame retardant. 收起 | |
| Epotec® YD 128 X | Aditya Birla | Epotec® YD 128 X is a modified, medium viscosity, bisphenol-A-based epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, elec...展開 Epotec® YD 128 X is a modified, medium viscosity, bisphenol-A-based epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, electronic, and flooring applications. 收起 | |
| Epotec® YD 128 XX | Aditya Birla | Epotec® YD 128 XX is a medium viscosity, bisphenol-A-based modified epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, elec...展開 Epotec® YD 128 XX is a medium viscosity, bisphenol-A-based modified epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, electronic, and flooring applications. 收起 | |
| Epoxies® 20-1615 | Epoxies, Etc. | Epoxies® 20-1615 is a clear, orderless, two part silicone rubber compound that is low in viscosity and cures in room temperature. Primarily used for potting electronic assemblies that require shock and vibration resistance, it can also protect assemblies ...展開 Epoxies® 20-1615 is a clear, orderless, two part silicone rubber compound that is low in viscosity and cures in room temperature. Primarily used for potting electronic assemblies that require shock and vibration resistance, it can also protect assemblies from moisture, ozone, chemicals and other environmental hazards. 收起 | |
| UV Cure 60-7155 | Epoxies, Etc. | UV Cure 60-7155 is a one part epoxy adhesive and potting compound that cures with low intensity black light or high intensity UV lamps. Displaying good moisture and chemical resistance, along with a deep section cure, this product is ideal for potting and...展開 UV Cure 60-7155 is a one part epoxy adhesive and potting compound that cures with low intensity black light or high intensity UV lamps. Displaying good moisture and chemical resistance, along with a deep section cure, this product is ideal for potting and encapsulating applications. 收起 | |
| Docure TH-452 | Kukdo Chemical Co., Ltd. | Docure TH-452 is aromatic amine modified curing agent for use with epoxy resins. It can be applied for civil engineering, architecture, linings, adhesives, electrical tools, etc. TH-452 is well suited for use in the production of castings and pottings. | |
| Docure TH-451 | Kukdo Chemical Co., Ltd. | Docure TH-451 is aromatic amine modified curing agent for use with epoxy resins. It can be applied for civil engineering, architecture, linings, adhesives, electrical tools, etc. TH-451 is well suited for use in the production of castings and pottings. | |
| Epoxies® 20-3004 HV | Epoxies, Etc. | Epoxies® 20-3004 HV is a high viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates incl...展開 Epoxies® 20-3004 HV is a high viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates including most metals and plastics. 20-3004's high viscosity prevents sagging and is noncorrosive. 收起 | |
| Epoxies® 20-2621 | Epoxies, Etc. | Epoxies® 20-2621 is a crystal clear, two part, polyurethane potting and encapsulating compound designed for applications requiring "water like" clarity. This product curse at room temperature and will not yellow over time wile providing excellent environm...展開 Epoxies® 20-2621 is a crystal clear, two part, polyurethane potting and encapsulating compound designed for applications requiring "water like" clarity. This product curse at room temperature and will not yellow over time wile providing excellent environmental protection. 20-2621 is semi-flexible and will not place excess stress on electronic components. It also has a low viscosity, which facilitates easy flow and penetration into difficult areas. 收起 | |
| Epoxies® 20-1634 | Epoxies, Etc. | Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent...展開 Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent electrical insulation properties. 20-1634 is formulated without solvents or other toxic materials. As a result, no by-products are released during the cure process and it is safe to handle. 收起 | |
| Epoxies® 20-2121 | Epoxies, Etc. | Epoxies® is a clear to amber colored elastomeric potting and encapsulating compound made of polyurethane. Specifically formulated for electronic potting, encapsulating and casting applications, it is a two-component, low viscosity, room temperature curing...展開 Epoxies® is a clear to amber colored elastomeric potting and encapsulating compound made of polyurethane. Specifically formulated for electronic potting, encapsulating and casting applications, it is a two-component, low viscosity, room temperature curing system that does not contain TDI, MbOCA or Mercury. 20-2121 can be used to cushion and protect sensitive electronic components and will impart very little stress on components during cure or thermal cycling. 收起 | |
| Epoxies® 20-2028 | Epoxies, Etc. | Epoxies® 20-2028 is a two part, light weight, closed cell, liquid polyurethane foaming resin system designed for potting and encapsulating. It is a water blown rigid foam that does not contain any hydrochlorofluorocarbon (HCFC). And thus, it is also safe...展開 Epoxies® 20-2028 is a two part, light weight, closed cell, liquid polyurethane foaming resin system designed for potting and encapsulating. It is a water blown rigid foam that does not contain any hydrochlorofluorocarbon (HCFC). And thus, it is also safer to use since it does not utilize MOCA or TDI. 20-2028 has been formulated for ease in handling with a convenient 1:1 mix ratio, low viscosity, and short demolding time. 收起 | |
| Epoxies® 20-2362 FR | Epoxies, Etc. | Epoxies® 20-2362 FR is a two part, potting and encapsulating compound that has been formulated to meet the stringent non-burning requirements of UL-94 V-0. This system offers a unique combination of properties. 20-2362 is very low in viscosity, flame reta...展開 Epoxies® 20-2362 FR is a two part, potting and encapsulating compound that has been formulated to meet the stringent non-burning requirements of UL-94 V-0. This system offers a unique combination of properties. 20-2362 is very low in viscosity, flame retardant, has a glass transition temperature of -72°C, and has low moisture permeability. This product forms a soft elastomer that will cushion and protect sensitive electronic components. 收起 | |
| Epoxies® 20-1700 | Epoxies, Etc. | Epoxies® 20-1700 is a two part, potting and encapsulating clear silicone gel that has a soft and fast cure process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protec...展開 Epoxies® 20-1700 is a two part, potting and encapsulating clear silicone gel that has a soft and fast cure process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1700 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. 收起 | |
| Epoxies® 20-1705 | Epoxies, Etc. | Epoxies® 20-1705 is a two part, potting and encapsulating clear silicone gel that has a firm and fast curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide prot...展開 Epoxies® 20-1705 is a two part, potting and encapsulating clear silicone gel that has a firm and fast curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1705 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. 收起 | |
| Epoxies® 20-1710 | Epoxies, Etc. | Epoxies® 20-1710 is a two part, potting and encapsulating clear silicone gel that has a soft and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide ...展開 Epoxies® 20-1710 is a two part, potting and encapsulating clear silicone gel that has a soft and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1710 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. 收起 | |
| Epoxies® 20-1715 | Epoxies, Etc. | Epoxies® 20-1715 is a two part, potting and encapsulating clear silicone gel that has a firm and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide ...展開 Epoxies® 20-1715 is a two part, potting and encapsulating clear silicone gel that has a firm and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1715 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. 收起 | |
| Epotec® YD 134 | Aditya Birla | Epotec® YD 134 is an unmodified, high viscosity, bisphenol-A-based semi-solid epoxy resin used to impart or improve toughness, flexibility, and adhesion. This product is ideal for use in adhesives, marine & industrial protective coatings, solvent-based co...展開 Epotec® YD 134 is an unmodified, high viscosity, bisphenol-A-based semi-solid epoxy resin used to impart or improve toughness, flexibility, and adhesion. This product is ideal for use in adhesives, marine & industrial protective coatings, solvent-based coatings, construction coatings & systems, and electrical & electronic applications. 收起 | |
| Epoxies® 20-2101 | Epoxies, Etc. | Epoxies® 20-2101 is a clear two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is ma...展開 Epoxies® 20-2101 is a clear two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is made from Natural Oil Polyol (NOP) obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. 收起 | |
| Epoxies® 20-2160 | Epoxies, Etc. | Epoxies® 20-2160 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is ma...展開 Epoxies® 20-2160 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is made from Natural Oil Polyol (NOP) obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. 收起 | |
| Epoxies® 20-2180 | Epoxies, Etc. | Epoxies® 20-2180 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is ma...展開 Epoxies® 20-2180 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is made from Natural Oil Polyol (NOP) obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. 收起 | |
| Epoxies® 20-1640 | Epoxies, Etc. | Epoxies® 20-1640 is a two part silicone elastomer potting and encapsulating compound that forms a soft and highly flexible electrically insulating package when cured. It can be used for potting or encapsulating electronic packages that have sensitive comp...展開 Epoxies® 20-1640 is a two part silicone elastomer potting and encapsulating compound that forms a soft and highly flexible electrically insulating package when cured. It can be used for potting or encapsulating electronic packages that have sensitive components. Due to its low stress during and after cure, this material will not crush or damage delicate components. 20-1640 is formulated without solvents or other toxic materials. As a result, no by-products released during cure and safe to handle. 收起 | |
| Epotec® YD 128 J | Aditya Birla | Epotec® YD 128 J is an unmodified epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical strength and chemical resistance. This product is ideal for use in solvent-free co...展開 Epotec® YD 128 J is an unmodified epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical strength and chemical resistance. This product is ideal for use in solvent-free coatings, adhesives, and construction, electrical, & electronics applications. 收起 | |
| Epoxies® 20-1650 | Epoxies, Etc. | Epoxies® 20-1650 is a two part high temperature silicone potting and encapsulating compound and is formulated with iron oxide to impart increased stability at elevated temperatures. It can be used for potting or encapsulating electronic packages that have...展開 Epoxies® 20-1650 is a two part high temperature silicone potting and encapsulating compound and is formulated with iron oxide to impart increased stability at elevated temperatures. It can be used for potting or encapsulating electronic packages that have sensitive components. This material will not crush or damage delicate components due to its low stress during and after the curing process. 20-1650 is made without solvents or other toxic materials. As a result, no by-products are released during curing process and is safe to handle. 收起 | |
| Epoxies® 50-3185 NC | Epoxies, Etc. | Epoxies® 50-3185 NC is a filled, thermally conductive potting and encapsulating resin with excellent physical, electrical and thermal properties. It is well suited for applications where low thermal expansion, outstanding electrical insulation and/or high...展開 Epoxies® 50-3185 NC is a filled, thermally conductive potting and encapsulating resin with excellent physical, electrical and thermal properties. It is well suited for applications where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. 50-3185 NC is designed to work with a variety of catalysts to adjust additional properties including toughness, viscosity, thermal and mechanical shock values and cure times. This product is well suited for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc... 收起 | |
| Epoxies® 20-3064 NC | Epoxies, Etc. | Epoxies® 20-3064 NC is a filled, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3...展開 Epoxies® 20-3064 NC is a filled, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3064 NC provides excellent thermal shock resistance and outstanding adhesion. 收起 | |
| Epoxies® 20-3004 LV | Epoxies, Etc. | Epoxies® 20-3004 LV is a low viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates inclu...展開 Epoxies® 20-3004 LV is a low viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates including most metals and plastics. 20-3004's low viscosity lends itself to being a self leveling system and is noncorrosive. 收起 | |
| UV Cure 60-7159 | Epoxies, Etc. | UV Cure 60-7159 is a low viscosity conformal coating for Printed Circuit Boards (PCB’s), components and various substrates. When exposed to long wave UV it forms a tough, clear and flexible coating. UV Cure 60-7159 resists yellowing, vibration and impact....展開 UV Cure 60-7159 is a low viscosity conformal coating for Printed Circuit Boards (PCB’s), components and various substrates. When exposed to long wave UV it forms a tough, clear and flexible coating. UV Cure 60-7159 resists yellowing, vibration and impact. UV Cure 7159 does not contain any solvents and forms a smooth, non-sticky surface. 收起 | |
| Epokukdo YC-230 | Kukdo Chemical Co., Ltd. | Epokukdo YC-230 of casting resin system is a liquid type medium viscosity Bisphenol-A epoxy resin and medium-viscosity Hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it...展開 Epokukdo YC-230 of casting resin system is a liquid type medium viscosity Bisphenol-A epoxy resin and medium-viscosity Hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it shows excellent long-term behavior in terms with breakdown strength and discharge resistance. 收起 | |
| Epokukdo KC-335 | Kukdo Chemical Co., Ltd. | Epokukdo KC-335 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it...展開 Epokukdo KC-335 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it shows excellent long-term behavior in terms with breakdown strength and discharge resistance. 收起 | |
| Epokukdo KC-305 | Kukdo Chemical Co., Ltd. | Epokukdo KC-305 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it...展開 Epokukdo KC-305 of casting resin system is a liquid type medium viscosity bisphenol-A epoxy resin and medium-viscosity hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it shows excellent long-term behavior in terms with breakdown strength and discharge resistance. 收起 | |
| Epotec® YD 128 EL | Aditya Birla | Epotec® YD 128 EL is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for ...展開 Epotec® YD 128 EL is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for use in high solids solvent-free coatings, adhesives, and construction, electrical, & electronics applications. 收起 | |
| Epotec® YD 128 R | Aditya Birla | Epotec® YD 128 R is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for u...展開 Epotec® YD 128 R is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for use in high solids solvent-free coatings, adhesives, and construction, electrical, & electronics applications. 收起 | |
| Docure YC-230H | Kukdo Chemical Co., Ltd. | Docure YC-230H of casting resin system is a liquid type medium viscosity Bisphenol-A epoxy resin and medium-viscosity Hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it ...展開 Docure YC-230H of casting resin system is a liquid type medium viscosity Bisphenol-A epoxy resin and medium-viscosity Hardener, respectively. This cured resin gives outstanding resistance to mechanical and electrical stresses and thermal shocks. Also, it shows excellent long-term behavior in terms with breakdown strength and discharge resistance. 收起 | |
| Epoxies® 50-3152 FR | Epoxies, Etc. | Epoxies® 50-3152 FR is a flame retardant, thermally conductive potting and encapsulating compound that has been formulated to meet the strict non-burning requirements of UL 94-0. It is a two part epoxy that turns black when cured and has excellent shock a...展開 Epoxies® 50-3152 FR is a flame retardant, thermally conductive potting and encapsulating compound that has been formulated to meet the strict non-burning requirements of UL 94-0. It is a two part epoxy that turns black when cured and has excellent shock and vibration resistance along with good thermal conductivity. Epoxies® 50-3152 FR is low in viscosity and is designed for ease of use with a convenient 1:1 mix ratio. 收起 | |
| Docure TH-438 | Kukdo Chemical Co., Ltd. | Docure TH-438 is an aromatic amine modified curing agent for use with epoxy resins. TH-438 has been applied for civil engineering, architecture, linings, adhesives, electrical tools due to its excellent characteristics. It is well suited for use in produc...展開 Docure TH-438 is an aromatic amine modified curing agent for use with epoxy resins. TH-438 has been applied for civil engineering, architecture, linings, adhesives, electrical tools due to its excellent characteristics. It is well suited for use in production of coatings that require additional chemical resistance. 收起 | |
| Docure TH-432 | Kukdo Chemical Co., Ltd. | Docure TH-432 is an aromatic amine modified curing agents for use with epoxy resins. TH-432 can be applied for civil engineering, architecture, linings, adhesives, electrical tools, etc. TH-432 has a normal cure type when compared to TH-451 and TH-452 whi...展開 Docure TH-432 is an aromatic amine modified curing agents for use with epoxy resins. TH-432 can be applied for civil engineering, architecture, linings, adhesives, electrical tools, etc. TH-432 has a normal cure type when compared to TH-451 and TH-452 which are fast cure type. 收起 | |
| Docure TH-431 | Kukdo Chemical Co., Ltd. | Docure TH-431 is an aromatic amine modified curing agents for use with epoxy resins. TH-431 can be applied for civil engineering, architecture, linings, adhesives, electrical tools, etc. TH-431 has a normal cure type when compared to TH-451 and TH-452 whi...展開 Docure TH-431 is an aromatic amine modified curing agents for use with epoxy resins. TH-431 can be applied for civil engineering, architecture, linings, adhesives, electrical tools, etc. TH-431 has a normal cure type when compared to TH-451 and TH-452 which are fast cure type. 收起 | |
| UV Cure 60-7108 | Epoxies, Etc. | UV Cure 60-7108 is a low viscosity and optically clear UV curable epoxy system designed for fiber optic and other clear adhesive and potting applications. With good electrical insulation properties and moisture resistance, this product is ideal for use in...展開 UV Cure 60-7108 is a low viscosity and optically clear UV curable epoxy system designed for fiber optic and other clear adhesive and potting applications. With good electrical insulation properties and moisture resistance, this product is ideal for use in the manufacture of electronic assemblies. Low viscosity makes it suitable for a variety of other coating applications. 收起 | |
| Epoxies® 50-3151 NC FR | Epoxies, Etc. | Epoxies® 50-3151 NC FR is a low viscosity flame retardant made of a thermally conductive epoxy resin that has been developed to meet the stringent non-burning requirements of UL 94 V-0. This system offers excellent heat transfer, low shrinkage, and outsta...展開 Epoxies® 50-3151 NC FR is a low viscosity flame retardant made of a thermally conductive epoxy resin that has been developed to meet the stringent non-burning requirements of UL 94 V-0. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. Primarily used in encapsulating power supplies, transformers, coils, insulators, sensors, etc... Epoxies® 50-3151 NC FR is an excellent choice for applications requiring high thermal conductivity, flame retardancy, and low viscosity. 收起 | |
| UV Cure 60-7156 | Epoxies, Etc. | UV Cure 60-7156 is a one part flexible epoxy adhesive and potting compound that can cure in low intensity black light or high intensity UV lamps. Its low durometer (flexibility) provides less stress on sensitive electronic components. This product is wate...展開 UV Cure 60-7156 is a one part flexible epoxy adhesive and potting compound that can cure in low intensity black light or high intensity UV lamps. Its low durometer (flexibility) provides less stress on sensitive electronic components. This product is water clear, moisture and chemical resistant, and designed to be used as an adhesive, coating, or encapsulant. 收起 | |
| Epoxies® 20-3064 NC LV | Epoxies, Etc. | Epoxies® 20-3064 NC LV is a low viscosity, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Sho...展開 Epoxies® 20-3064 NC LV is a low viscosity, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3064 NC provides excellent thermal shock resistance and outstanding adhesion. 收起 | |
| Epoxies® 20-3236 | Epoxies, Etc. | Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenien...展開 Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenient 2:1 mix ratio. 20-3236 Resin can also be used for the encapsulation of vinyl insulated electrical components or sealing vinyl lead wires. 收起 | |
| Epoxies® 50-3112 | Epoxies, Etc. | Epoxies® 50-3112 is a two part, fast curing thermally conductive epoxy adhesive. Dark grey in color when mixed, this product a simple 1:1 mix ratio and develops a 1,400 psi Lap Shear strength bond (aluminum to aluminum) in four hours at room temperature ...展開 Epoxies® 50-3112 is a two part, fast curing thermally conductive epoxy adhesive. Dark grey in color when mixed, this product a simple 1:1 mix ratio and develops a 1,400 psi Lap Shear strength bond (aluminum to aluminum) in four hours at room temperature and 2,200 psi. just after 20 hours. 50-3112 offers fast heat dissipation for a wide range of electronic applications. The black resin and white hardener provide an excellent visual indication of a complete mix. 收起 | |
| Epoxies® 40-3911 | Epoxies, Etc. | Epoxies® 40-3911 is an electrically conductive, silver filled, epoxy adhesive that is formulated without solvents and is 100% solids. Because of it is highly filled with silver, it has a very low volume resistance rating of 5 X 10-4 ohm-cm. This one part ...展開 Epoxies® 40-3911 is an electrically conductive, silver filled, epoxy adhesive that is formulated without solvents and is 100% solids. Because of it is highly filled with silver, it has a very low volume resistance rating of 5 X 10-4 ohm-cm. This one part system cures quickly at elevated temperatures making it a suitable adhesive for many electronic assembly operations. And it is a good choice for lid sealing and die bonding applications. 收起 | |
| Epotec® YD 535 | Aditya Birla | Epotec® YD 535 is a low viscosity, modified, bisphenol-A-based epoxy resin which displays very good wet out and degassing, as well as excellent adhesion and mechanical, physical, and thermal properties. This product is ideal for use in coatings and adhesi...展開 Epotec® YD 535 is a low viscosity, modified, bisphenol-A-based epoxy resin which displays very good wet out and degassing, as well as excellent adhesion and mechanical, physical, and thermal properties. This product is ideal for use in coatings and adhesives for fiber-reinforced structural components - such as those used in automotive, sporting equipment, navy, aeronautic, marine, and electrical insulation applications. 收起 | |
| Epoxies® 40-3900 | Epoxies, Etc. | Epoxies® 40-3900 is a two part, silver filled, epoxy resin adhesive that is electrically conductive and has a very low resistance value of less than 1x10-4 ohm-cm. 40-3900 is specifically designed for adhesive bonding in microelectronic and optoelectronic...展開 Epoxies® 40-3900 is a two part, silver filled, epoxy resin adhesive that is electrically conductive and has a very low resistance value of less than 1x10-4 ohm-cm. 40-3900 is specifically designed for adhesive bonding in microelectronic and optoelectronic applications. Due to its excellent continuity, it has also been used extensively in applications such as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder. 收起 | |
| UV Cure 60-7170 | Epoxies, Etc. | UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. This system is water clear, moisture and chemical resistant, and designed to be used as an adhesive, coating, or encapsulant. UV Cure 60-7170 i...展開 UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. This system is water clear, moisture and chemical resistant, and designed to be used as an adhesive, coating, or encapsulant. UV Cure 60-7170 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to “dark cure.” Once exposed to UV light the UV Cure 60-7170 will continue to cure in the absence of light. 收起 | |
| Epokukdo YDF-165 | Kukdo Chemical Co., Ltd. | Epokukdo YDF-165 is a Bisphenol-F type liquid epoxy resin diluted with BGE , which is very low viscosity. YDF-165 has the excellent mechanical, adhesive, electrical, and chemical resistance properties after being cured with appropriate curing agents. Due ...展開 Epokukdo YDF-165 is a Bisphenol-F type liquid epoxy resin diluted with BGE , which is very low viscosity. YDF-165 has the excellent mechanical, adhesive, electrical, and chemical resistance properties after being cured with appropriate curing agents. Due to its special properties, YDF-165 is generally used in coatings, moldings, adhesives, construction and civil works, and composite applications for the low VOC or non-solvent system. 收起 | |
| Epokukdo YDF-162 | Kukdo Chemical Co., Ltd. | Epokukdo YDF-162 is a non-diluted Bisphenol-A/F type liquid Epoxy Resin. YDF-162 is recommended for high solid system or low VOC coating system with excellent mechanical properties and chemical resistance without toxic odor. YDF-162 is generally used in a...展開 Epokukdo YDF-162 is a non-diluted Bisphenol-A/F type liquid Epoxy Resin. YDF-162 is recommended for high solid system or low VOC coating system with excellent mechanical properties and chemical resistance without toxic odor. YDF-162 is generally used in anti-corrosive coating, floor coating, crack injection systems, grouts, adhesives, casting, composite application and many high solids or low VOC industrial coatings. 收起 | |
| Epokukdo YDF-170 | Kukdo Chemical Co., Ltd. | Epokukdo YDF-170 is a liquid type epoxy resins derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-170 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appr...展開 Epokukdo YDF-170 is a liquid type epoxy resins derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-170 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appropriate curing agents. Due to its special properties, YDF-170 is generally used in coatings, moldings, adhesive, construction and civil works, and composite applications for the low VOC or non-solvent system. 收起 | |
| Epokukdo YC-195 | Kukdo Chemical Co., Ltd. | Epokukdo YC-195 is molding epoxy resin with a low softening point. It is used for making mold products, which require excellent mechanical and electrical properties, by combination with acid anhydride curing agents. This product is especially suitable for...展開 Epokukdo YC-195 is molding epoxy resin with a low softening point. It is used for making mold products, which require excellent mechanical and electrical properties, by combination with acid anhydride curing agents. This product is especially suitable for large size electric mold that needs high reliability due to its dimensional stability. YC-195 can be mainly used as dielectric material for high voltage transformer, high voltage converter, resin insulator, bushing and high voltage switch, etc. 收起 | |
| Epokukdo YDF-175 | Kukdo Chemical Co., Ltd. | Epokukdo YDF-175 is a liquid type epoxy resins derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-175 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appr...展開 Epokukdo YDF-175 is a liquid type epoxy resins derived from BPF and ECH. Especially, it has low viscosity without diluents or modifiers. YDF-175 has excellent mechanical, adhesion, electrical, and chemical resistance properties after being cured with appropriate curing agents. Due to its special properties, YDF-175 is generally used in coatings, moldings, adhesive, construction and civil works, and composite applications for the low VOC or non-solvent system. YDF-175 is specially designed for non-crystalline type in cold weather. 收起 | |
| Epokukdo KBPN-120 | Kukdo Chemical Co., Ltd. | Epokukdo KBPN-120 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-120 is a small molec...展開 Epokukdo KBPN-120 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-120 is a small molecular type of KBPN series and is used for the product which requires the characteristics of heat resistance, chemical resistance and low temp erature curability, high Tg for Powder Coating or Laminates. It also has high reactivity so that it is curable at ambient temperature. 收起 | |
| Epokukdo KBPN-115 | Kukdo Chemical Co., Ltd. | Epokukdo KBPN-115 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-110 is a small molec...展開 Epokukdo KBPN-115 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-110 is a small molecular type of KBPN series and is used for the product which requires the characteristics of heat resistance, chemical resistance and low temp erature curability, high Tg for Powder Coating or Laminates. It also has high reactivity so that it is curable at ambient temperature. 收起 | |
| UV Cure 60-7105 | Epoxies, Etc. | UV Cure 60-7105 is a low viscosity urethane adhesive, coating, and potting compound. This UV curable resin exhibits good adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. Thi...展開 UV Cure 60-7105 is a low viscosity urethane adhesive, coating, and potting compound. This UV curable resin exhibits good adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. This material is a good choice for products requiring deep section curing. 收起 | |
| UV Cure 60-7111 | Epoxies, Etc. | UV Cure 60-7111 is a non-yellowing, UV curable urethane adhesive and encapsulant featuring high impact strength and flexibility, as well as good water and weather resistance. This product is formulated to provide low stress on electronics and displays goo...展開 UV Cure 60-7111 is a non-yellowing, UV curable urethane adhesive and encapsulant featuring high impact strength and flexibility, as well as good water and weather resistance. This product is formulated to provide low stress on electronics and displays good adhesion to a variety of substances. 收起 |
