| Epotec® YD 127 FP | Aditya Birla | Epotec® YD 127 FP is an unmodified, low viscosity liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. This product is ideal for use in high solids solvent-free coatings, laminates, and electrical & electronics applications. | |
| Epotec® YD 128 EL | Aditya Birla | Epotec® YD 128 EL is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for ...veja mais Epotec® YD 128 EL is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for use in high solids solvent-free coatings, adhesives, and construction, electrical, & electronics applications. veja menos | |
| Epotec® YD 128 J | Aditya Birla | Epotec® YD 128 J is an unmodified epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical strength and chemical resistance. This product is ideal for use in solvent-free co...veja mais Epotec® YD 128 J is an unmodified epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical strength and chemical resistance. This product is ideal for use in solvent-free coatings, adhesives, and construction, electrical, & electronics applications. veja menos | |
| Epotec® YD 128 R | Aditya Birla | Epotec® YD 128 R is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for u...veja mais Epotec® YD 128 R is an unmodified liquid epoxy resin reaction product of bisphenol-A and epichlorohydrin. When cured with an appropriate hardener, it delivers excellent mechanical, chemical, electrical, and adhesion properties. This product is ideal for use in high solids solvent-free coatings, adhesives, and construction, electrical, & electronics applications. veja menos | |
| Epotec® YD 128 X | Aditya Birla | Epotec® YD 128 X is a modified, medium viscosity, bisphenol-A-based epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, elec...veja mais Epotec® YD 128 X is a modified, medium viscosity, bisphenol-A-based epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, electronic, and flooring applications. veja menos | |
| Epotec® YD 128 XX | Aditya Birla | Epotec® YD 128 XX is a medium viscosity, bisphenol-A-based modified epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, elec...veja mais Epotec® YD 128 XX is a medium viscosity, bisphenol-A-based modified epoxy resin which displays good chemical resistance, resistance to crystallization on storage, and pigment and filler wetting properties. This product is ideal for use in electrical, electronic, and flooring applications. veja menos | |
| Epotec® YD 134 | Aditya Birla | Epotec® YD 134 is an unmodified, high viscosity, bisphenol-A-based semi-solid epoxy resin used to impart or improve toughness, flexibility, and adhesion. This product is ideal for use in adhesives, marine & industrial protective coatings, solvent-based co...veja mais Epotec® YD 134 is an unmodified, high viscosity, bisphenol-A-based semi-solid epoxy resin used to impart or improve toughness, flexibility, and adhesion. This product is ideal for use in adhesives, marine & industrial protective coatings, solvent-based coatings, construction coatings & systems, and electrical & electronic applications. veja menos | |
| Epotec® YD 535 | Aditya Birla | Epotec® YD 535 is a low viscosity, modified, bisphenol-A-based epoxy resin which displays very good wet out and degassing, as well as excellent adhesion and mechanical, physical, and thermal properties. This product is ideal for use in coatings and adhesi...veja mais Epotec® YD 535 is a low viscosity, modified, bisphenol-A-based epoxy resin which displays very good wet out and degassing, as well as excellent adhesion and mechanical, physical, and thermal properties. This product is ideal for use in coatings and adhesives for fiber-reinforced structural components - such as those used in automotive, sporting equipment, navy, aeronautic, marine, and electrical insulation applications. veja menos | |
| Epotec® YDF 170 | Aditya Birla | Epotec® YDF 170 is a general-purpose, unmodified, low viscosity diglycidyl ether of bisphenol-F which displays good chemical resistance. This product is ideal for use in adhesives for electronic applications, chemical resistance coatings, industrial floor...veja mais Epotec® YDF 170 is a general-purpose, unmodified, low viscosity diglycidyl ether of bisphenol-F which displays good chemical resistance. This product is ideal for use in adhesives for electronic applications, chemical resistance coatings, industrial flooring applications, and laminates. veja menos | |
| Epotec® YDF 173 | Aditya Birla | Epotec® YDF 173 is a higher functional novolac resin featuring improved thermal stability, hardness, mechanical strength, and resistance to various chemicals. This product is ideal for use in adhesives for electronic applications, chemical resistant coati...veja mais Epotec® YDF 173 is a higher functional novolac resin featuring improved thermal stability, hardness, mechanical strength, and resistance to various chemicals. This product is ideal for use in adhesives for electronic applications, chemical resistant coatings, industrial flooring applications, and laminates. veja menos | |
| Epoxies® 20-1615 | Epoxies, Etc. | Epoxies® 20-1615 is a clear, orderless, two part silicone rubber compound that is low in viscosity and cures in room temperature. Primarily used for potting electronic assemblies that require shock and vibration resistance, it can also protect assemblies ...veja mais Epoxies® 20-1615 is a clear, orderless, two part silicone rubber compound that is low in viscosity and cures in room temperature. Primarily used for potting electronic assemblies that require shock and vibration resistance, it can also protect assemblies from moisture, ozone, chemicals and other environmental hazards. veja menos | |
| Epoxies® 20-1625 | Epoxies, Etc. | Epoxies® 20-1625 is a two part optically clear silicone potting and encapsulating compound with a low viscosity and easy 1:1 ratio system. 20-1625 is formulated without solvents or other toxic materials and provides good heat resistance and is flame retar...veja mais Epoxies® 20-1625 is a two part optically clear silicone potting and encapsulating compound with a low viscosity and easy 1:1 ratio system. 20-1625 is formulated without solvents or other toxic materials and provides good heat resistance and is flame retardant. veja menos | |
| Epoxies® 20-1634 | Epoxies, Etc. | Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent...veja mais Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent electrical insulation properties. 20-1634 is formulated without solvents or other toxic materials. As a result, no by-products are released during the cure process and it is safe to handle. veja menos | |
| Epoxies® 20-1640 | Epoxies, Etc. | Epoxies® 20-1640 is a two part silicone elastomer potting and encapsulating compound that forms a soft and highly flexible electrically insulating package when cured. It can be used for potting or encapsulating electronic packages that have sensitive comp...veja mais Epoxies® 20-1640 is a two part silicone elastomer potting and encapsulating compound that forms a soft and highly flexible electrically insulating package when cured. It can be used for potting or encapsulating electronic packages that have sensitive components. Due to its low stress during and after cure, this material will not crush or damage delicate components. 20-1640 is formulated without solvents or other toxic materials. As a result, no by-products released during cure and safe to handle. veja menos | |
| Epoxies® 20-1650 | Epoxies, Etc. | Epoxies® 20-1650 is a two part high temperature silicone potting and encapsulating compound and is formulated with iron oxide to impart increased stability at elevated temperatures. It can be used for potting or encapsulating electronic packages that have...veja mais Epoxies® 20-1650 is a two part high temperature silicone potting and encapsulating compound and is formulated with iron oxide to impart increased stability at elevated temperatures. It can be used for potting or encapsulating electronic packages that have sensitive components. This material will not crush or damage delicate components due to its low stress during and after the curing process. 20-1650 is made without solvents or other toxic materials. As a result, no by-products are released during curing process and is safe to handle. veja menos | |
| Epoxies® 20-1700 | Epoxies, Etc. | Epoxies® 20-1700 is a two part, potting and encapsulating clear silicone gel that has a soft and fast cure process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protec...veja mais Epoxies® 20-1700 is a two part, potting and encapsulating clear silicone gel that has a soft and fast cure process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1700 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. veja menos | |
| Epoxies® 20-1705 | Epoxies, Etc. | Epoxies® 20-1705 is a two part, potting and encapsulating clear silicone gel that has a firm and fast curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide prot...veja mais Epoxies® 20-1705 is a two part, potting and encapsulating clear silicone gel that has a firm and fast curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1705 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. veja menos | |
| Epoxies® 20-1710 | Epoxies, Etc. | Epoxies® 20-1710 is a two part, potting and encapsulating clear silicone gel that has a soft and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide ...veja mais Epoxies® 20-1710 is a two part, potting and encapsulating clear silicone gel that has a soft and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1710 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. veja menos | |
| Epoxies® 20-1715 | Epoxies, Etc. | Epoxies® 20-1715 is a two part, potting and encapsulating clear silicone gel that has a firm and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide ...veja mais Epoxies® 20-1715 is a two part, potting and encapsulating clear silicone gel that has a firm and extended curing process. It has excellent electrical properties and their soft cushioning provide vibration and thermal shock protection. It can also provide protection from moisture, dust and other environmental contaminants. Due to its electrical properties, dielectric strength, and resistivity the 20-1715 can be used to encapsulate electronic components, junction boxes, power modules and LED’s. veja menos | |
| Epoxies® 20-2028 | Epoxies, Etc. | Epoxies® 20-2028 is a two part, light weight, closed cell, liquid polyurethane foaming resin system designed for potting and encapsulating. It is a water blown rigid foam that does not contain any hydrochlorofluorocarbon (HCFC). And thus, it is also safe...veja mais Epoxies® 20-2028 is a two part, light weight, closed cell, liquid polyurethane foaming resin system designed for potting and encapsulating. It is a water blown rigid foam that does not contain any hydrochlorofluorocarbon (HCFC). And thus, it is also safer to use since it does not utilize MOCA or TDI. 20-2028 has been formulated for ease in handling with a convenient 1:1 mix ratio, low viscosity, and short demolding time. veja menos | |
| Epoxies® 20-2101 | Epoxies, Etc. | Epoxies® 20-2101 is a clear two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is ma...veja mais Epoxies® 20-2101 is a clear two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is made from Natural Oil Polyol (NOP) obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. veja menos | |
| Epoxies® 20-2121 | Epoxies, Etc. | Epoxies® is a clear to amber colored elastomeric potting and encapsulating compound made of polyurethane. Specifically formulated for electronic potting, encapsulating and casting applications, it is a two-component, low viscosity, room temperature curing...veja mais Epoxies® is a clear to amber colored elastomeric potting and encapsulating compound made of polyurethane. Specifically formulated for electronic potting, encapsulating and casting applications, it is a two-component, low viscosity, room temperature curing system that does not contain TDI, MbOCA or Mercury. 20-2121 can be used to cushion and protect sensitive electronic components and will impart very little stress on components during cure or thermal cycling. veja menos | |
| Epoxies® 20-2160 | Epoxies, Etc. | Epoxies® 20-2160 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is ma...veja mais Epoxies® 20-2160 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is made from Natural Oil Polyol (NOP) obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. veja menos | |
| Epoxies® 20-2180 | Epoxies, Etc. | Epoxies® 20-2180 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is ma...veja mais Epoxies® 20-2180 is a black two part polyurethane potting and encapsulating resin engineered for use in electronics and casting purposes. It is low in viscosity, low in toxicity and is suitable for a variety of electronic insulating applications. It is made from Natural Oil Polyol (NOP) obtained directly from a plant source without chemical modifications. Using renewable resources, such as NOP’s, will reduce the demand on non-renewable fossil fuels and reduce the overall production of carbon dioxide. veja menos | |
| Epoxies® 20-2330 | Epoxies, Etc. | Epoxies® 20-2330 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...veja mais Epoxies® 20-2330 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2330 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. veja menos | |
| Epoxies® 20-2345 | Epoxies, Etc. | Epoxies® 20-2345 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...veja mais Epoxies® 20-2345 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2345 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. veja menos | |
| Epoxies® 20-2362 FR | Epoxies, Etc. | Epoxies® 20-2362 FR is a two part, potting and encapsulating compound that has been formulated to meet the stringent non-burning requirements of UL-94 V-0. This system offers a unique combination of properties. 20-2362 is very low in viscosity, flame reta...veja mais Epoxies® 20-2362 FR is a two part, potting and encapsulating compound that has been formulated to meet the stringent non-burning requirements of UL-94 V-0. This system offers a unique combination of properties. 20-2362 is very low in viscosity, flame retardant, has a glass transition temperature of -72°C, and has low moisture permeability. This product forms a soft elastomer that will cushion and protect sensitive electronic components. veja menos | |
| Epoxies® 20-2370 | Epoxies, Etc. | Epoxies® 20-2370 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...veja mais Epoxies® 20-2370 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2370 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. veja menos | |
| Epoxies® 20-2390 | Epoxies, Etc. | Epoxies® 20-2390 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling p...veja mais Epoxies® 20-2390 is a black, two part unfilled low durometer urethane elastomer used in potting, casting, and encapsulating. It is engineered to provide excellent hydrolytic stability and low moisture permeability. As well as outstanding thermal cycling properties, low glass transition temperatures and low embedment stress to sensitive electronic components. Epoxies® 20-2390 can maintain its integrity over a wide operating temperature range. With a low glass transition temperature of approximately -70°C makes these urethanes ideal for low temperature potting applications. veja menos | |
| Epoxies® 20-2521 | Epoxies, Etc. | Epoxies® 20-2521 is a black, two part, polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cy...veja mais Epoxies® 20-2521 is a black, two part, polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. Epoxies® 20-2521 is also well known for its outstanding thermal shock and excellent dielectric properties. It is also a good choice when exposure to salt water, mild acids and bases, and aliphatic hydrocarbons is expected. veja menos | |
| Epoxies® 20-2523 | Epoxies, Etc. | Epoxies® 20-2523 is a black, two part, high performance polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throu...veja mais Epoxies® 20-2523 is a black, two part, high performance polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. Epoxies® 20-2521 is also well known for its outstanding thermal shock and excellent dielectric properties. It is also a good choice when exposure to salt water, mild acids and bases, and aliphatic hydrocarbons is expected. veja menos | |
| Epoxies® 20-2621 | Epoxies, Etc. | Epoxies® 20-2621 is a crystal clear, two part, polyurethane potting and encapsulating compound designed for applications requiring "water like" clarity. This product curse at room temperature and will not yellow over time wile providing excellent environm...veja mais Epoxies® 20-2621 is a crystal clear, two part, polyurethane potting and encapsulating compound designed for applications requiring "water like" clarity. This product curse at room temperature and will not yellow over time wile providing excellent environmental protection. 20-2621 is semi-flexible and will not place excess stress on electronic components. It also has a low viscosity, which facilitates easy flow and penetration into difficult areas. veja menos | |
| Epoxies® 20-3001 NC | Epoxies, Etc. | Epoxies® 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating resin which forms a bubble free glass like finish upon curing. It is either black or clear and dose not contain any solvents. with a 1 to 1 mix ratio and lack of fillers, it ...veja mais Epoxies® 20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating resin which forms a bubble free glass like finish upon curing. It is either black or clear and dose not contain any solvents. with a 1 to 1 mix ratio and lack of fillers, it is an ideal material for meter mixes and dispense equipment. veja menos | |
| Epoxies® 20-3004 HV | Epoxies, Etc. | Epoxies® 20-3004 HV is a high viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates incl...veja mais Epoxies® 20-3004 HV is a high viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates including most metals and plastics. 20-3004's high viscosity prevents sagging and is noncorrosive. veja menos | |
| Epoxies® 20-3004 LV | Epoxies, Etc. | Epoxies® 20-3004 LV is a low viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates inclu...veja mais Epoxies® 20-3004 LV is a low viscosity, two part, chemical resistant epoxy system that has been developed for potting, coating and adhesive applications requiring superior chemical resistance. It exhibits outstanding bonds to a variety of substrates including most metals and plastics. 20-3004's low viscosity lends itself to being a self leveling system and is noncorrosive. veja menos | |
| Epoxies® 20-3006 | Epoxies, Etc. | Epoxies® 20-3006 is a two part, flexible epoxy potting and encapsulating compound specially formulated to provide electrical insulation, chemical protection and thermal shock resistance. Its flexibility provides low stress on surface mounts and other deli...veja mais Epoxies® 20-3006 is a two part, flexible epoxy potting and encapsulating compound specially formulated to provide electrical insulation, chemical protection and thermal shock resistance. Its flexibility provides low stress on surface mounts and other delicate electronic components. 20-3006 has an easy one to one mix ratio, and is D.O.T. non-hazardous. veja menos | |
| Epoxies® 20-3035 | Epoxies, Etc. | Epoxies® 20-3035 is a low density, to part epoxy potting and encapsulating compound with half the weight of most commercially available potting compounds on the market. it exhibits low shrinkage during the cure process with a low coefficient of thermal ex...veja mais Epoxies® 20-3035 is a low density, to part epoxy potting and encapsulating compound with half the weight of most commercially available potting compounds on the market. it exhibits low shrinkage during the cure process with a low coefficient of thermal expansion. 20-3035 is an ideal materail for the potting of electron assemblies where a low dielectric constant and low weight are required. veja menos | |
| Epoxies® 20-3060 | Epoxies, Etc. | Epoxies® 20-3060 is a low viscosity, general purpose, epoxy potting and encapsulating resin made from 100% solids and dose not contain any solvents. It has exceptional resistance to impact, vibration, and thermal shock. In addition, this versatile resin s...veja mais Epoxies® 20-3060 is a low viscosity, general purpose, epoxy potting and encapsulating resin made from 100% solids and dose not contain any solvents. It has exceptional resistance to impact, vibration, and thermal shock. In addition, this versatile resin system is machinable and ideal for use with meter mix dispensing equipment. 20-3060 is recommended for applications requiring the optimum in over-all properties and where rigid or flexible wire leads protrude directly from the encapsulation. It also adheres extremely well to lead materials, such as vinyl, neoprene, natural rubber, etc. veja menos | |
| Epoxies® 20-3064 NC | Epoxies, Etc. | Epoxies® 20-3064 NC is a filled, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3...veja mais Epoxies® 20-3064 NC is a filled, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3064 NC provides excellent thermal shock resistance and outstanding adhesion. veja menos | |
| Epoxies® 20-3064 NC LV | Epoxies, Etc. | Epoxies® 20-3064 NC LV is a low viscosity, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Sho...veja mais Epoxies® 20-3064 NC LV is a low viscosity, flexible epoxy potting compound and adhesive, developed to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3064 NC provides excellent thermal shock resistance and outstanding adhesion. veja menos | |
| Epoxies® 20-3068 | Epoxies, Etc. | Epoxies® 20-3068 is a two part epoxy adhesive and potting compound that can cure in room temperatures and has excellent chemical and corrosion resistance. This product provides good water resistance, adhesion, and toughness and is well suited for use with...veja mais Epoxies® 20-3068 is a two part epoxy adhesive and potting compound that can cure in room temperatures and has excellent chemical and corrosion resistance. This product provides good water resistance, adhesion, and toughness and is well suited for use with most electronics. 20-3068 Epoxy System meets the Food and Drug Administration (FDA) regulations permitting use in “indirect” food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. veja menos | |
| Epoxies® 20-3236 | Epoxies, Etc. | Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenien...veja mais Epoxies® 20-3236 is a low viscosity, copolymer elastomer made of a modified epoxy resin that is specifically designed for bonding vinyls and neoprenes. It can be used in many difficult bonding applications and has an extended working time with a convenient 2:1 mix ratio. 20-3236 Resin can also be used for the encapsulation of vinyl insulated electrical components or sealing vinyl lead wires. veja menos | |
| Epoxies® 20-3300 | Epoxies, Etc. | Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with ...veja mais Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with an extended pot life and has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Well suited for high voltage applications. veja menos | |
| Epoxies® 20-3302 | Epoxies, Etc. | Epoxies® 20-3302 is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excel...veja mais Epoxies® 20-3302 is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excellent optical transmission along with outstanding adhesion and electrical properties. 20-3302 is a low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring a bubble free and glass smooth finish with optimum clarity. veja menos | |
| Epoxies® 20-3302NCLV | Epoxies, Etc. | Epoxies® 20-3302NCLV is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides e...veja mais Epoxies® 20-3302NCLV is a two part, water clear, optically transparent epoxy potting compound and adhesive. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. It provides excellent optical transmission along with outstanding adhesion and electrical properties. 20-3302NCLV is a very low viscosity system designed for L.E.D. encapsulating, fiber optics, and any potting or adhesive application requiring a bubble free and glass smooth finish with optimum clarity. veja menos | |
| Epoxies® 40-3900 | Epoxies, Etc. | Epoxies® 40-3900 is a two part, silver filled, epoxy resin adhesive that is electrically conductive and has a very low resistance value of less than 1x10-4 ohm-cm. 40-3900 is specifically designed for adhesive bonding in microelectronic and optoelectronic...veja mais Epoxies® 40-3900 is a two part, silver filled, epoxy resin adhesive that is electrically conductive and has a very low resistance value of less than 1x10-4 ohm-cm. 40-3900 is specifically designed for adhesive bonding in microelectronic and optoelectronic applications. Due to its excellent continuity, it has also been used extensively in applications such as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder. veja menos | |
| Epoxies® 40-3905 | Epoxies, Etc. | Epoxies® 40-3905 is an electrically epoxy adhesive and coating system designed for applications requiring low temperature cures. It will cure at room temperature in 18-24 hours and can be accelerated with mild heat. Epoxies® 40-3905 is a solvent free epo...veja mais Epoxies® 40-3905 is an electrically epoxy adhesive and coating system designed for applications requiring low temperature cures. It will cure at room temperature in 18-24 hours and can be accelerated with mild heat. Epoxies® 40-3905 is a solvent free epoxy filled with pure silver for improved electrical conduction and heat transfer. It has outstanding adhesion to plastics, aluminum, copper, magnesium, steel, bronze, nickel, kovar, ceramic, glass, phenolic, and printed circuit boards. 40-3905 can also be thinned with up to 10% Toluol for many coating applications. veja menos | |
| Epoxies® 40-3909 | Epoxies, Etc. | Epoxies® 40-3909 is a two part epoxy resin adhesive and coating compound, filled with a highly conductive, silver coated nickel. It is designed to provide low volume resistivity of less than 5x10-3 ohm-cm. Silver coated nickel offers a lower cost alternat...veja mais Epoxies® 40-3909 is a two part epoxy resin adhesive and coating compound, filled with a highly conductive, silver coated nickel. It is designed to provide low volume resistivity of less than 5x10-3 ohm-cm. Silver coated nickel offers a lower cost alternative to many silver filled epoxy systems. 40-3909 has a convenient 1:1 mix ratio by weight and can cure at room temperature overnight but can also be accelerated with mild heat. It is well suited for use in the assembly or repairs of printed circuit boards, connectors, wave guides, high frequency shields, and as a cold solder. veja menos | |
| Epoxies® 40-3911 | Epoxies, Etc. | Epoxies® 40-3911 is an electrically conductive, silver filled, epoxy adhesive that is formulated without solvents and is 100% solids. Because of it is highly filled with silver, it has a very low volume resistance rating of 5 X 10-4 ohm-cm. This one part ...veja mais Epoxies® 40-3911 is an electrically conductive, silver filled, epoxy adhesive that is formulated without solvents and is 100% solids. Because of it is highly filled with silver, it has a very low volume resistance rating of 5 X 10-4 ohm-cm. This one part system cures quickly at elevated temperatures making it a suitable adhesive for many electronic assembly operations. And it is a good choice for lid sealing and die bonding applications. veja menos | |
| Epoxies® 50-3100 | Epoxies, Etc. | Epoxies® 50-3100 is a high thermal K heat transfer epoxy resin designed for fast and continuous heat transfer. Primarily used for the encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc....veja mais Epoxies® 50-3100 is a high thermal K heat transfer epoxy resin designed for fast and continuous heat transfer. Primarily used for the encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc. 50-3100 measures several times faster heat dissipation than other commercially available types and can be easily mixed and poured to form a dimensionally stable heat transfer package. veja menos | |
| Epoxies® 50-3112 | Epoxies, Etc. | Epoxies® 50-3112 is a two part, fast curing thermally conductive epoxy adhesive. Dark grey in color when mixed, this product a simple 1:1 mix ratio and develops a 1,400 psi Lap Shear strength bond (aluminum to aluminum) in four hours at room temperature ...veja mais Epoxies® 50-3112 is a two part, fast curing thermally conductive epoxy adhesive. Dark grey in color when mixed, this product a simple 1:1 mix ratio and develops a 1,400 psi Lap Shear strength bond (aluminum to aluminum) in four hours at room temperature and 2,200 psi. just after 20 hours. 50-3112 offers fast heat dissipation for a wide range of electronic applications. The black resin and white hardener provide an excellent visual indication of a complete mix. veja menos | |
| Epoxies® 50-3122 | Epoxies, Etc. | Epoxies® 50-3122 is a one part epoxy adhesive with both high sheer and high peel strength properties. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50-3122 is both a thermally conductive and electri...veja mais Epoxies® 50-3122 is a one part epoxy adhesive with both high sheer and high peel strength properties. It is also able to maintain exceptionally strong bonds over a wide temperature range of -60 to +205°C. 50-3122 is both a thermally conductive and electrically insulating epoxy adhesive. It is suitable for electronic, electrical, aerospace, appliance, automotive and industrial applications. veja menos | |
| Epoxies® 50-3150 FR | Epoxies, Etc. | Epoxies® 50-3150 is a flame retardant, thermally conductive epoxy resin that has been formulated to meet the stringent non-burning requirements of UL94 V-0. It is a black epoxy mixed with catalyst 190 and catalyst 30 and offers great heat transfer, low sh...veja mais Epoxies® 50-3150 is a flame retardant, thermally conductive epoxy resin that has been formulated to meet the stringent non-burning requirements of UL94 V-0. It is a black epoxy mixed with catalyst 190 and catalyst 30 and offers great heat transfer, low shrinkage, and outstanding insulation properties. Primarily used for encapsulating power supplies, transformers, coils, insulators, sensors, etc... Epoxies® 50-3150 FR is an excellent choice for applications requiring high thermal conductivity and flame retardancy. veja menos | |
| Epoxies® 50-3151 NC FR | Epoxies, Etc. | Epoxies® 50-3151 NC FR is a low viscosity flame retardant made of a thermally conductive epoxy resin that has been developed to meet the stringent non-burning requirements of UL 94 V-0. This system offers excellent heat transfer, low shrinkage, and outsta...veja mais Epoxies® 50-3151 NC FR is a low viscosity flame retardant made of a thermally conductive epoxy resin that has been developed to meet the stringent non-burning requirements of UL 94 V-0. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. Primarily used in encapsulating power supplies, transformers, coils, insulators, sensors, etc... Epoxies® 50-3151 NC FR is an excellent choice for applications requiring high thermal conductivity, flame retardancy, and low viscosity. veja menos | |
| Epoxies® 50-3152 FR | Epoxies, Etc. | Epoxies® 50-3152 FR is a flame retardant, thermally conductive potting and encapsulating compound that has been formulated to meet the strict non-burning requirements of UL 94-0. It is a two part epoxy that turns black when cured and has excellent shock a...veja mais Epoxies® 50-3152 FR is a flame retardant, thermally conductive potting and encapsulating compound that has been formulated to meet the strict non-burning requirements of UL 94-0. It is a two part epoxy that turns black when cured and has excellent shock and vibration resistance along with good thermal conductivity. Epoxies® 50-3152 FR is low in viscosity and is designed for ease of use with a convenient 1:1 mix ratio. veja menos | |
| Epoxies® 50-3170 | Epoxies, Etc. | Epoxies® 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. The resin has a rubber consistency and retains its properties and f...veja mais Epoxies® 50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. The resin has a rubber consistency and retains its properties and flexibility on long term aging. This allows pottings and castings to be probed for detection of electrical failure. 50-3170 can be used for bonding sensitive components or for potting of power supplies, coils, glass diodes, and other delicate assemblies. This new formulation can be used successfully for transformers, regulators, PCB's, etc... veja menos | |
| Epoxies® 50-3182 NC | Epoxies, Etc. | Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferr...veja mais Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferring heat. 50-3182 NC is designed to work with a variety of catalysts to adjust additional properties including toughness, viscosity, thermal and mechanical shock values and cure times. This product is well suited for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc... veja menos | |
| Epoxies® 50-3185 NC | Epoxies, Etc. | Epoxies® 50-3185 NC is a filled, thermally conductive potting and encapsulating resin with excellent physical, electrical and thermal properties. It is well suited for applications where low thermal expansion, outstanding electrical insulation and/or high...veja mais Epoxies® 50-3185 NC is a filled, thermally conductive potting and encapsulating resin with excellent physical, electrical and thermal properties. It is well suited for applications where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. 50-3185 NC is designed to work with a variety of catalysts to adjust additional properties including toughness, viscosity, thermal and mechanical shock values and cure times. This product is well suited for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc... veja menos | |
| Epoxies® 50-3186 NC | Epoxies, Etc. | Epoxies® 50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal e...veja mais Epoxies® 50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance. veja menos | |
| HS9514 | Tianyi Chemical Engineering Material Co., Ltd. | HS9514, in the form of a transparent liquid, is an aliphatic urethane acrylate that can be used in stain resistant coatings and PCB photo-resistant coatings. This product is resistant to yellowing, stains, and abrasion. Its substrate is an oligomer that...veja mais HS9514, in the form of a transparent liquid, is an aliphatic urethane acrylate that can be used in stain resistant coatings and PCB photo-resistant coatings. This product is resistant to yellowing, stains, and abrasion. Its substrate is an oligomer that performs well in radiation or peroxide cure applications. veja menos | |
| LS2-6140 | NuSil Silicone Technology 1 | LS2-6140 is an optically clear, primerless silicone encapsulant that has a low volatility and a high purity. This product can help protect electrical components and assemblies from moisture, chemicals, dust, shock, vibration, and other environmental hazar...veja mais LS2-6140 is an optically clear, primerless silicone encapsulant that has a low volatility and a high purity. This product can help protect electrical components and assemblies from moisture, chemicals, dust, shock, vibration, and other environmental hazards. It has exceptional thermal stability and is designed to work in optically harsh environments where high power led and uv led packages are a factor. veja menos | |
| LS2-6941 | NuSil Silicone Technology 1 | LS2-6941 is an optically clear silicone elastomer that has a low viscosity and is solvent free. This product offers excellent physical and electrical stability across a broad temperature range. It can be used for photonics applications such as photo detec...veja mais LS2-6941 is an optically clear silicone elastomer that has a low viscosity and is solvent free. This product offers excellent physical and electrical stability across a broad temperature range. It can be used for photonics applications such as photo detectors, lasers, HBLEDs, discrete optics and flat panel displays that require a 1.41 refractive index. It can also provide protection for electronic components from vibration, shock, dust, moisture and other environmental hazards by potting or encapsulating. veja menos | |
| Picassian® AC-191 | Stahl Polymers | Picassian® AC-191 is a waterbased anionic styrene acrylic copolymer emulsion agent. It is used in consumer electronics, metallic coatings, and in general plastic applications. This product is brittle, has good adhesion on ABS and PS, has good scratch resi...veja mais Picassian® AC-191 is a waterbased anionic styrene acrylic copolymer emulsion agent. It is used in consumer electronics, metallic coatings, and in general plastic applications. This product is brittle, has good adhesion on ABS and PS, has good scratch resistance properties, good alcohol resistance, has good hand cream resistance, is stable with treated aluminium flakes, and provides clear, very hard, and glossy films. veja menos | |
| R-1130 | NuSil Silicone Technology 1 | R-1130 is a non-corrosive, rapid curing, nun-slumping RTV silicone adhesive that can be used as a coating for semi-conductors and integrated circuits. It can also be utilized as an adhesive/sealant for electrical wires, terminals, mounting resistors and ...veja mais R-1130 is a non-corrosive, rapid curing, nun-slumping RTV silicone adhesive that can be used as a coating for semi-conductors and integrated circuits. It can also be utilized as an adhesive/sealant for electrical wires, terminals, mounting resistors and connectors. It is ideal for overhead or side wall applications due to its non-slumping characteristics. veja menos | |
| R-2175 | NuSil Silicone Technology 1 | R-2175 is a two-part, black, pourable, self-leveling silicone potting elastomer that cures at room temperature. The low viscosity of this product allows for the potting of complex geometries without entrapping air. It is thermally stable, flowable, and ha...veja mais R-2175 is a two-part, black, pourable, self-leveling silicone potting elastomer that cures at room temperature. The low viscosity of this product allows for the potting of complex geometries without entrapping air. It is thermally stable, flowable, and has several applications which include potting for connectors, sensors, relays, power devices and other electronic components that require protection from shock, vibration and other environmental hazards. veja menos | |
| R-2188 | NuSil Silicone Technology 1 | R-2188 is a silicone potting and encapsulating elastomer that is pourable, self-leveling, and cures at room temperature. This product is ideal for the encapsulating, potting and coating of modules, relays, and a variety of AC/DC converters including high ...veja mais R-2188 is a silicone potting and encapsulating elastomer that is pourable, self-leveling, and cures at room temperature. This product is ideal for the encapsulating, potting and coating of modules, relays, and a variety of AC/DC converters including high power and planar packages. It can help protect against shock, vibration, moisture, contaminants and dust. The low viscosity of this elastomer will allow the potting of complex geometries, and it will not trap air. veja menos | |
| R-2370 | NuSil Silicone Technology 1 | R-2370 is a two-part, RTV silicone rubber foam that has a 100:6 Mix Ratio (Base: Catalyst). It yields a low density silicone rubber foam when catalyzed. It is best utilized in shock and vibration dampening situations that require a flexible, light weight ...veja mais R-2370 is a two-part, RTV silicone rubber foam that has a 100:6 Mix Ratio (Base: Catalyst). It yields a low density silicone rubber foam when catalyzed. It is best utilized in shock and vibration dampening situations that require a flexible, light weight foam with exceptional electrical and thermal properties. veja menos | |
| R-2380 | NuSil Silicone Technology 1 | R-2380 is a two-part, RTV silicone rubber foam that yields a medium density, and has a 100:6 Mix Ratio (Base: Catalyst). This product is specifically designed to be used in vibration and shock dampening situations that require a lightweight, flexible foam...veja mais R-2380 is a two-part, RTV silicone rubber foam that yields a medium density, and has a 100:6 Mix Ratio (Base: Catalyst). This product is specifically designed to be used in vibration and shock dampening situations that require a lightweight, flexible foam that also has exceptional thermal and electrical properties. veja menos | |
| R-2630 | NuSil Silicone Technology 1 | R-2630 is a black, electrically conductive RTV silicone that has a high durometer. It is based on a methyl silicone polymer and has a broad temperature range. This product can be used to adhere covers on housings or where grooves or other configurations r...veja mais R-2630 is a black, electrically conductive RTV silicone that has a high durometer. It is based on a methyl silicone polymer and has a broad temperature range. This product can be used to adhere covers on housings or where grooves or other configurations require a flowable to limited flow material with a low viscosity. It can also be used for RFI and EMI shielding for space and electrical applications. It is well suited for formed in place conductive gaskets and has an operating temperature range of 65°C to 200°C (-85°F to 392°F). veja menos | |
| R-2655 | NuSil Silicone Technology 1 | R-2655 is a high strength, transparent RTV silicone elastomer that has a low viscosity and an accelerated cure rate when heat is added. This product can be used to provide environmental protection in potting, encapsulating and coating applications where r...veja mais R-2655 is a high strength, transparent RTV silicone elastomer that has a low viscosity and an accelerated cure rate when heat is added. This product can be used to provide environmental protection in potting, encapsulating and coating applications where radiation resistance, low temperature flexibility, oxidation and thermal stability are needed. The low viscosity of this elastomer allows for easy flow around complex parts and it provides exceptional shock and electrical insulation resistance. veja menos | |
| R-2930 | NuSil Silicone Technology 1 | R-2930 is a two-part, white, thermally conductive silicone that cures rapidly with the addition of heat. This product can be used as an adhesive for integrated circuit substrates, heat sinks, base plates or where grooves or other configurations require a ...veja mais R-2930 is a two-part, white, thermally conductive silicone that cures rapidly with the addition of heat. This product can be used as an adhesive for integrated circuit substrates, heat sinks, base plates or where grooves or other configurations require a non-flowable to limited flow material. It can also provide the transfer of heat between electrical/electronic components and their heat sinks. veja menos | |
| R-2939 | NuSil Silicone Technology 1 | R-2939 is a two-part, white, pourable, thermally conductive silicone that has a low viscosity and cures rapidly with the addition of heat. It can provide the transfer of heat between electrical/electronic components and their heat sinks. This product is i...veja mais R-2939 is a two-part, white, pourable, thermally conductive silicone that has a low viscosity and cures rapidly with the addition of heat. It can provide the transfer of heat between electrical/electronic components and their heat sinks. This product is ideally used as an adhesive for openings in modules and housings where grooves or other configurations require a non-flowable to limited flow material. veja menos | |
| R-2940 | NuSil Silicone Technology 1 | R-2940 is a thermally conductive silicone that has a high strength that can be cured rapidly with the addition of heat. It can be used to adhere base plates, integrated circuit substrates, heat sinks, and other configurations that require a material that ...veja mais R-2940 is a thermally conductive silicone that has a high strength that can be cured rapidly with the addition of heat. It can be used to adhere base plates, integrated circuit substrates, heat sinks, and other configurations that require a material that is non-flowable to a limited flow. It can also be used to provide heat transfer between electrical/electronic components and their heat sinks. veja menos | |
| R3-1075 | NuSil Silicone Technology 1 | R3-1075 is a one part, RTV silicone dispersion that has a non-corrosive cure. This product can be used as a protective coating that will prevent erosion and corrosion of various parts and surfaces in rockets, missiles, aircraft and launch equipment. It ca...veja mais R3-1075 is a one part, RTV silicone dispersion that has a non-corrosive cure. This product can be used as a protective coating that will prevent erosion and corrosion of various parts and surfaces in rockets, missiles, aircraft and launch equipment. It can also be utilized as a conformal coating for electrical and electronic components including rigid and flexible printed circuit boards. veja menos | |
| SCV-2585 | NuSil Silicone Technology 1 | SCV-2585 is a silicone elastomer that features Ultra Low OutgassingTM and also has a high tear strength. This makes it an ideal product to provide protection to electronic components against shock, vibration, moisture, dust and other environmental hazards...veja mais SCV-2585 is a silicone elastomer that features Ultra Low OutgassingTM and also has a high tear strength. This makes it an ideal product to provide protection to electronic components against shock, vibration, moisture, dust and other environmental hazards. It can also perform under a broad temperature range for electronic and space applications. veja menos | |
| SCV-2596 | NuSil Silicone Technology 1 | SCV-2596 is a two-part, black electrically conductive RTV silicone that can be used for RFI and EMI shielding in electronic and space applications. This product can be used to adhere covers onto housing or for any application where grooves and other confi...veja mais SCV-2596 is a two-part, black electrically conductive RTV silicone that can be used for RFI and EMI shielding in electronic and space applications. This product can be used to adhere covers onto housing or for any application where grooves and other configurations require a flowable to limited flow material. It features Ultra Low OutgassingTM which helps it perform under extreme operating conditions and helps avoid condensation in sensitive devices. veja menos | |
| SCV1-2599 | NuSil Silicone Technology 1 | SCV1-2599 is a two-part, white, thermally conductive silicone that cures with the addition of heat. It provides heat transfer between electrical/electronic components and their heat sinks. This product can be used to adhere integrated circuit substrates, ...veja mais SCV1-2599 is a two-part, white, thermally conductive silicone that cures with the addition of heat. It provides heat transfer between electrical/electronic components and their heat sinks. This product can be used to adhere integrated circuit substrates, base plates, heat sinks or where grooves require a non-flowable to limited flow material. veja menos | |
| SCV2-2590 | NuSil Silicone Technology 1 | SCV2-2590 is a clear silicone that features Ultra Low OutgassingTM and has a low viscosity. It exceeds low outgas specifications outlined in NASA and the European Space Agency. This product can act as an embedding compound for environmental protection of ...veja mais SCV2-2590 is a clear silicone that features Ultra Low OutgassingTM and has a low viscosity. It exceeds low outgas specifications outlined in NASA and the European Space Agency. This product can act as an embedding compound for environmental protection of electronic components. It will protect against extreme temperatures, humidity, radiation, thermal and mechanical stress. veja menos | |
| SCV2-2599 | NuSil Silicone Technology 1 | SCV2-2599 is a thixotropic, thermally conductive silicone that is designed to allow bond line thicknesses of < or = 50 microns. This product cures with the addition of heat and provides heat transfer between electrical/electronic components and their heat...veja mais SCV2-2599 is a thixotropic, thermally conductive silicone that is designed to allow bond line thicknesses of < or = 50 microns. This product cures with the addition of heat and provides heat transfer between electrical/electronic components and their heat sinks. It can also be used as an adhesive for base plates, integrated circuit substrates, heat sinks or where grooves require a non-flow material. veja menos | |
| UV Cure 60-7105 | Epoxies, Etc. | UV Cure 60-7105 is a low viscosity urethane adhesive, coating, and potting compound. This UV curable resin exhibits good adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. Thi...veja mais UV Cure 60-7105 is a low viscosity urethane adhesive, coating, and potting compound. This UV curable resin exhibits good adhesion, toughness, and exterior durability. UV Cure 60-7105 does not contain any solvents and is therefore a 100% solids system. This material is a good choice for products requiring deep section curing. veja menos | |
| UV Cure 60-7108 | Epoxies, Etc. | UV Cure 60-7108 is a low viscosity and optically clear UV curable epoxy system designed for fiber optic and other clear adhesive and potting applications. With good electrical insulation properties and moisture resistance, this product is ideal for use in...veja mais UV Cure 60-7108 is a low viscosity and optically clear UV curable epoxy system designed for fiber optic and other clear adhesive and potting applications. With good electrical insulation properties and moisture resistance, this product is ideal for use in the manufacture of electronic assemblies. Low viscosity makes it suitable for a variety of other coating applications. veja menos | |
| UV Cure 60-7111 | Epoxies, Etc. | UV Cure 60-7111 is a non-yellowing, UV curable urethane adhesive and encapsulant featuring high impact strength and flexibility, as well as good water and weather resistance. This product is formulated to provide low stress on electronics and displays goo...veja mais UV Cure 60-7111 is a non-yellowing, UV curable urethane adhesive and encapsulant featuring high impact strength and flexibility, as well as good water and weather resistance. This product is formulated to provide low stress on electronics and displays good adhesion to a variety of substances. veja menos | |
| UV Cure 60-7114 | Epoxies, Etc. | UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound, and coating with very good adhesion to metal and plastic substrates. This UV curable resin is formulated to provide excellent water and chemical resistance, making it a good choice fo...veja mais UV Cure 60-7114 is a low viscosity urethane adhesive, potting compound, and coating with very good adhesion to metal and plastic substrates. This UV curable resin is formulated to provide excellent water and chemical resistance, making it a good choice for potting electronic assemblies exposed to excessive moisture. veja menos | |
| UV Cure 60-7155 | Epoxies, Etc. | UV Cure 60-7155 is a one part epoxy adhesive and potting compound that cures with low intensity black light or high intensity UV lamps. Displaying good moisture and chemical resistance, along with a deep section cure, this product is ideal for potting and...veja mais UV Cure 60-7155 is a one part epoxy adhesive and potting compound that cures with low intensity black light or high intensity UV lamps. Displaying good moisture and chemical resistance, along with a deep section cure, this product is ideal for potting and encapsulating applications. veja menos | |
| UV Cure 60-7156 | Epoxies, Etc. | UV Cure 60-7156 is a one part flexible epoxy adhesive and potting compound that can cure in low intensity black light or high intensity UV lamps. Its low durometer (flexibility) provides less stress on sensitive electronic components. This product is wate...veja mais UV Cure 60-7156 is a one part flexible epoxy adhesive and potting compound that can cure in low intensity black light or high intensity UV lamps. Its low durometer (flexibility) provides less stress on sensitive electronic components. This product is water clear, moisture and chemical resistant, and designed to be used as an adhesive, coating, or encapsulant. veja menos | |
| UV Cure 60-7159 | Epoxies, Etc. | UV Cure 60-7159 is a low viscosity conformal coating for Printed Circuit Boards (PCB’s), components and various substrates. When exposed to long wave UV it forms a tough, clear and flexible coating. UV Cure 60-7159 resists yellowing, vibration and impact....veja mais UV Cure 60-7159 is a low viscosity conformal coating for Printed Circuit Boards (PCB’s), components and various substrates. When exposed to long wave UV it forms a tough, clear and flexible coating. UV Cure 60-7159 resists yellowing, vibration and impact. UV Cure 7159 does not contain any solvents and forms a smooth, non-sticky surface. veja menos | |
| UV Cure 60-7170 | Epoxies, Etc. | UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. This system is water clear, moisture and chemical resistant, and designed to be used as an adhesive, coating, or encapsulant. UV Cure 60-7170 i...veja mais UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. This system is water clear, moisture and chemical resistant, and designed to be used as an adhesive, coating, or encapsulant. UV Cure 60-7170 is a good choice for potting and encapsulating applications due to its ability to deep section cure up to ¾ inch. Another unique and important feature is its ability to “dark cure.” Once exposed to UV light the UV Cure 60-7170 will continue to cure in the absence of light. veja menos | |
| UV Cure 60-7180 | Epoxies, Etc. | UV Cure 60-7180 is a one part, UV curable adhesive that is water clear and exhibits great yellowing resistance has been formulated to cure instantly when exposed to high intensity ultraviolet light. This product is ideal for use as an adhesive and coating...veja mais UV Cure 60-7180 is a one part, UV curable adhesive that is water clear and exhibits great yellowing resistance has been formulated to cure instantly when exposed to high intensity ultraviolet light. This product is ideal for use as an adhesive and coating on a wide variety of substrates. It can also be used in small potting applications as well as decorative clear doming on labels, pins, key fobs, magnets, etc. veja menos |
