| AC-70 | Ark (Fogang) Chemicals Industry Co., Ltd. | AC-70 is a Vinyltri tert-butyl peroxide silane with the chemical formula of C14H30O6Si and comes as a yellowish liquid. Primarily used as an adhesive and sealant, it is used extensively in the rubber industry. AC-70 can bond to other rubber, silicon, and ...veja mais AC-70 is a Vinyltri tert-butyl peroxide silane with the chemical formula of C14H30O6Si and comes as a yellowish liquid. Primarily used as an adhesive and sealant, it is used extensively in the rubber industry. AC-70 can bond to other rubber, silicon, and metal substrates. veja menos | |
| AC-75 | Ark (Fogang) Chemicals Industry Co., Ltd. | AC-75 is a Vinyl triethoxysilane with the chemical structure CH2=CHSi(OC2H5)3, and comes as a colorless transparent liquid. Primarily used in the production of vinyl and acrylic co-polymers, AC-75 can be used as an adhesion promoter in polymers for glass ...veja mais AC-75 is a Vinyl triethoxysilane with the chemical structure CH2=CHSi(OC2H5)3, and comes as a colorless transparent liquid. Primarily used in the production of vinyl and acrylic co-polymers, AC-75 can be used as an adhesion promoter in polymers for glass / metallic substrates. veja menos | |
| Aquarez EVA T21 | Aquaspersions | Aquarez EVA T21 is an APEO-free, water-based emulsion of a tackified EVA terpolymer. This product has excellent adhesion to a wide variety of substrates, including aluminum, polyethylene, polyester and paper. It can be used as a base for the formulation...veja mais Aquarez EVA T21 is an APEO-free, water-based emulsion of a tackified EVA terpolymer. This product has excellent adhesion to a wide variety of substrates, including aluminum, polyethylene, polyester and paper. It can be used as a base for the formulation of low-activation temperature heat-seal coating. Aquarez EVA T21 comes in a low-viscosity, easy-to-handle water-based form and has excellent storage stability. veja menos | |
| Aquarez EVA T25 | Aquaspersions | Aquarez EVA T25 is a water-based emulsion of a tackified, EVA-methacrylic acid terpolymer. This product has a fine particle size and narrow distribution, and exhibits excellent adhesion to a wide variety of substrates, including polypropylene, PVC, paper...veja mais Aquarez EVA T25 is a water-based emulsion of a tackified, EVA-methacrylic acid terpolymer. This product has a fine particle size and narrow distribution, and exhibits excellent adhesion to a wide variety of substrates, including polypropylene, PVC, paper and aluminum. It can be used as the base for the formulation of low-activation temperature heat-seal coatings. Aquarez EVA T25 comes in a low-viscosity, water-based form and exhibits excellent storage stability and high emulsion stability in the finished product. veja menos | |
| Blendex 55 F | Ichemco | Blendex 55 F is a solvent-free, one-component moisture curing polyurethane adhesive. This product has a viscosity at 100°C of 750-1000 mPa.s. Blendex 55 F is most commonly used in fabric and film lamination applications. | |
| Blendex 70 A | Ichemco | Blendex 70 A is a monocomponent polyurethane adhesive in solvent phase (Ethyl Acetate). solvent-based, heat sealable adhesive. This product has a total solids content of 64-66% and a Brookfield viscosity at 25°C of 670-870 cPs. Blendex 70 A is most common...veja mais Blendex 70 A is a monocomponent polyurethane adhesive in solvent phase (Ethyl Acetate). solvent-based, heat sealable adhesive. This product has a total solids content of 64-66% and a Brookfield viscosity at 25°C of 670-870 cPs. Blendex 70 A is most commonly used as a solvent adhesive in coating system applications. veja menos | |
| Blendex 75 A | Ichemco | Blendex 75 A is a monocomponent polyurethane adhesive in solvent phase (Ethyl Acetate) solvent-based, heat sealable adhesive. This product has a total solids content of 74-76% and a Brookfield viscosity at 25°C of 3300-5300 cPs. Blendex 75 A is most comm...veja mais Blendex 75 A is a monocomponent polyurethane adhesive in solvent phase (Ethyl Acetate) solvent-based, heat sealable adhesive. This product has a total solids content of 74-76% and a Brookfield viscosity at 25°C of 3300-5300 cPs. Blendex 75 A is most commonly used as a solvent adhesive in coating system applications. veja menos | |
| Blendex 81 T | Ichemco | Blendex 81 T is a a two-component polyurethane adhesive in ethyl acetate, solvent-based, heat sealable adhesive. This product has a total solids content of 58-62% and a Brookfield viscosity at 25°C of 2300-4300 cPs. Blendex 81 T is most commonly used in f...veja mais Blendex 81 T is a a two-component polyurethane adhesive in ethyl acetate, solvent-based, heat sealable adhesive. This product has a total solids content of 58-62% and a Brookfield viscosity at 25°C of 2300-4300 cPs. Blendex 81 T is most commonly used in film and fabric lamination applications. veja menos | |
| Blendex B1 | Ichemco | Blendex B1 is a liquid blend of synthetic polymers and natural resins. This product has a viscosity at 3500-8000 cPa. Blendex B1 is most commonly used in solvent adhesive production applications. | |
| Blendex Seal DH 14 | Ichemco | Blendex Seal DH 14 is a polyester based, aliphatic acqueous polyurethane dispersion, water-based, heat sealable adhesive. This product has a total solids content of 29-31%. Blendex Seal DH 14 is most commonly used as a heat sealable adhesive in textile ap...veja mais Blendex Seal DH 14 is a polyester based, aliphatic acqueous polyurethane dispersion, water-based, heat sealable adhesive. This product has a total solids content of 29-31%. Blendex Seal DH 14 is most commonly used as a heat sealable adhesive in textile applications. veja menos | |
| Blendex Seal DH 70 | Ichemco | Blendex Seal DH 70 is a water-based, heat sealable adhesive based on modified acrylic polymers. This product has a total solids content of 23-25% and a Brookfield viscosity at 25°C of 8000-16,000 mPa.s. Blendex Seal DH 70 is most commonly used as a heat s...veja mais Blendex Seal DH 70 is a water-based, heat sealable adhesive based on modified acrylic polymers. This product has a total solids content of 23-25% and a Brookfield viscosity at 25°C of 8000-16,000 mPa.s. Blendex Seal DH 70 is most commonly used as a heat sealable adhesive in fabric, non-woven, leather, foam, and synthetic leather applications. veja menos | |
| Blendex Seal DH 76 | Ichemco | Blendex Seal DH 76 is a water-based, heat sealable adhesive, formulated with modified acrylic co-polymers.. This product has a total solids content of 37.5-39.5% and a Brookfield viscosity at 25°C of 1000-1500 mPa.s. Blendex Seal DH 76 is most commonly us...veja mais Blendex Seal DH 76 is a water-based, heat sealable adhesive, formulated with modified acrylic co-polymers.. This product has a total solids content of 37.5-39.5% and a Brookfield viscosity at 25°C of 1000-1500 mPa.s. Blendex Seal DH 76 is most commonly used as a heat sealable elastic adhesive in woven, non-woven, leather, foam, and synthetic leather applications. veja menos | |
| Blendex Seal DH 8 | Ichemco | Blendex Seal DH 8 is a water-based, heat sealable adhesive based on a modified acrylic polymer. This product has a total solids content of 52-54%, and a Brookfield viscosity at 25°C of 2000-5000 mPa.s. Blendex Seal DH 8 is most commonly used as a heat s...veja mais Blendex Seal DH 8 is a water-based, heat sealable adhesive based on a modified acrylic polymer. This product has a total solids content of 52-54%, and a Brookfield viscosity at 25°C of 2000-5000 mPa.s. Blendex Seal DH 8 is most commonly used as a heat sealable adhesive in fabric, leather, foam, non-woven, and synthetic leather applications. veja menos | |
| Blendex Seal DH 8 M | Ichemco | Blendex Seal DH 8 M is a water-based, heat sealable adhesive based on a modified acrylic polymer. This product has a total solids content of 46-50% and a Brookfield viscosity at 25°C of 3000-6500 mPa.s. Blendex Seal DH 8 M is most commonly used as a heat ...veja mais Blendex Seal DH 8 M is a water-based, heat sealable adhesive based on a modified acrylic polymer. This product has a total solids content of 46-50% and a Brookfield viscosity at 25°C of 3000-6500 mPa.s. Blendex Seal DH 8 M is most commonly used as a heat sealable adhesive in fabric, non-woven, leather, foam, and synthetic leather applications. veja menos | |
| Blendex Seal DH 8 M (V2) | Ichemco | Blendex Seal DH 8 M (V2) is a water-based, heat sealable adhesive. This product has a total solids content of 46-50% and a Brookfield viscosity at 25°C of 17,000-27,000 mPa.s. Blendex Seal DH 8 M (V2) is most commonly used as a heat sealable adhesive in f...veja mais Blendex Seal DH 8 M (V2) is a water-based, heat sealable adhesive. This product has a total solids content of 46-50% and a Brookfield viscosity at 25°C of 17,000-27,000 mPa.s. Blendex Seal DH 8 M (V2) is most commonly used as a heat sealable adhesive in fabric, non-woven, leather, foam, and synthetic leather applications. veja menos | |
| Blendex Seal DH 8 M (V3) | Ichemco | Blendex Seal DH 8 M (V3) is a water-based, heat sealable adhesive. This product has a total solids content of 46-50% and a Brookfield viscosity at 25°C of 27,000-37,000 mPa.s. Blendex Seal DH 8 M (V3) is most commonly used as a heat sealable adhesive in f...veja mais Blendex Seal DH 8 M (V3) is a water-based, heat sealable adhesive. This product has a total solids content of 46-50% and a Brookfield viscosity at 25°C of 27,000-37,000 mPa.s. Blendex Seal DH 8 M (V3) is most commonly used as a heat sealable adhesive in fabric, non-woven, leather, foam, and synthetic leather applications. veja menos | |
| Blendex WUM | Ichemco | Blendex WUM is a water-based, synthetic latex heat sealable adhesive. This product has a total solids content of 39-41% and a Brookfield viscosity at 25°C of 1000-3000 mPa.s. Blendex WUM is most commonly used as a remoistable adhesive in paper and cardboa...veja mais Blendex WUM is a water-based, synthetic latex heat sealable adhesive. This product has a total solids content of 39-41% and a Brookfield viscosity at 25°C of 1000-3000 mPa.s. Blendex WUM is most commonly used as a remoistable adhesive in paper and cardboard applications. veja menos | |
| CH-4900 Silicon Structural Sealant | Yangzhou Chenhua New Material CO., LTD. | CH-4900 Silicon Structural Sealant is a a silicon structural sealant with has a high temperature resistance. This product has on-component, is neutral, and provides normal temperature curing. CH-4900 Silicon Structural Sealant provides weather, aging, ult...veja mais CH-4900 Silicon Structural Sealant is a a silicon structural sealant with has a high temperature resistance. This product has on-component, is neutral, and provides normal temperature curing. CH-4900 Silicon Structural Sealant provides weather, aging, ultraviolet, and ozone resistance to adhesives. veja menos | |
| CH-5800 Insulating Glass Sealant | Yangzhou Chenhua New Material CO., LTD. | CH-5800 Insulating Glass Sealant is a two-component, high intensity, high modulus, low permeability curing glass sealant. This product is used best on glass, metals, and marble. CH-5800 Insulating Glass Sealant provides weather, aging, ultraviolet, and oz...veja mais CH-5800 Insulating Glass Sealant is a two-component, high intensity, high modulus, low permeability curing glass sealant. This product is used best on glass, metals, and marble. CH-5800 Insulating Glass Sealant provides weather, aging, ultraviolet, and ozone resistance as a sealant. veja menos | |
| CH-5900 Silicon Structural Sealant | Yangzhou Chenhua New Material CO., LTD. | CH-5900 Silicon Structural Sealant is a two-component, neutral, normal temperature curing building silicon structural adhesive. This product has a high temperature resistance and is compatible with all neutral silicon adhesives. CH-5900 Silicon Structural...veja mais CH-5900 Silicon Structural Sealant is a two-component, neutral, normal temperature curing building silicon structural adhesive. This product has a high temperature resistance and is compatible with all neutral silicon adhesives. CH-5900 Silicon Structural Sealant is used to provide various resistances to adhesives. veja menos | |
| COPONYL™ 5065 | Nippon Gohsei | COPONYL™ 5065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics and is residue free. Applications include masking tapes and protective masking...veja mais COPONYL™ 5065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics and is residue free. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ 5411 | Nippon Gohsei | COPONYL™ 5411 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides permanent adhesion, and is suitable for thick-layer application. Applications include double-sided tapes and foam...veja mais COPONYL™ 5411 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides permanent adhesion, and is suitable for thick-layer application. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ 5560 | Nippon Gohsei | COPONYL™ 5560 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and isopropyl alcohol solvents. It is a one-component cross-linkage product. Applications include films and labels. This product is well ...veja mais COPONYL™ 5560 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and isopropyl alcohol solvents. It is a one-component cross-linkage product. Applications include films and labels. This product is well suited for use in adhesives. veja menos | |
| COPONYL™ 5672 | Nippon Gohsei | COPONYL™ 5672 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective maski...veja mais COPONYL™ 5672 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective masking films. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ 5697 | Nippon Gohsei | COPONYL™ 5697 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It is a general use hard-type resin used in PVC backing materials. This product is well suited for use in adhesives. | |
| COPONYL™ 5698 | Nippon Gohsei | COPONYL™ 5698 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It is a general use soft-type resin used in PVC backing materials. This product is well suited for use in adhesives. | |
| COPONYL™ 5705L | Nippon Gohsei | COPONYL™ 5705L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and low tack. Applications include masking tapes and protective masking films. This product is w...veja mais COPONYL™ 5705L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and low tack. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ 5706-A | Nippon Gohsei | COPONYL™ 5706-A is a pressure sensitive adhesive resin formulated from acrylic acid ester using toluene and cellosolve solvents. It is ideal for screen coatings. This product is well suited for use in adhesives. | |
| COPONYL™ 5740 | Nippon Gohsei | COPONYL™ 5740 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides slight adhesion, good removability, heat resistance, and is residue free. Applications include masking tapes, pro...veja mais COPONYL™ 5740 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides slight adhesion, good removability, heat resistance, and is residue free. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ 8065 | Nippon Gohsei | COPONYL™ 8065 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. This product is well suited for use in adhesives in medical applications such as fixing tapes for cataplasm and elastics. | |
| COPONYL™ 8137 | Nippon Gohsei | COPONYL™ 8137 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperatures. Applications include films and labels. This product is well suited for use in ...veja mais COPONYL™ 8137 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperatures. Applications include films and labels. This product is well suited for use in adhesives. veja menos | |
| COPONYL™ 8694 | Nippon Gohsei | COPONYL™ 8694 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective maski...veja mais COPONYL™ 8694 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides strong adhesion and good removability. Applications include films and labels, masking tapes, and protective masking films. This product is well suited for use in adhesives. veja menos | |
| COPONYL™ 8700 | Nippon Gohsei | COPONYL™ 8700 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good adhesion to olefin and is suitable for short-aging time. Applications include double-sided tapes and foam tapes. ...veja mais COPONYL™ 8700 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good adhesion to olefin and is suitable for short-aging time. Applications include double-sided tapes and foam tapes. This product is well suited for use in adhesives. veja menos | |
| COPONYL™ 8708 | Nippon Gohsei | COPONYL™ 8708 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well su...veja mais COPONYL™ 8708 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ 8711 | Nippon Gohsei | COPONYL™ 8711 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good processability and heat resistance. Applications include double-sided tapes and foam tapes. This product is well ...veja mais COPONYL™ 8711 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good processability and heat resistance. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ 8815 | Nippon Gohsei | COPONYL™ 8815 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good removability, is residue free, and has weather resistance properties. Applications include masking tapes and...veja mais COPONYL™ 8815 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good removability, is residue free, and has weather resistance properties. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ 8976L | Nippon Gohsei | COPONYL™ 8976L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good heat resistance. Applications include films and labels. This product is well suited for use in adhesives. | |
| COPONYL™ N-2031 | Nippon Gohsei | COPONYL™ N-2031 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. This product provides different levels of adhesive properties depending on temperature. Applications include masking tapes ...veja mais COPONYL™ N-2031 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. This product provides different levels of adhesive properties depending on temperature. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-2147 | Nippon Gohsei | COPONYL™ N-2147 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides heat resistance, dimension stability, and is suitable for window film. Applications include films and labels, P...veja mais COPONYL™ N-2147 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides heat resistance, dimension stability, and is suitable for window film. Applications include films and labels, PVC backing materials, and optical. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-2260 | Nippon Gohsei | COPONYL™ N-2260 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides low adhesion, high tack, is heat resistant, and residue free. Applications include masking tapes, protective ma...veja mais COPONYL™ N-2260 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides low adhesion, high tack, is heat resistant, and residue free. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-2332 | Nippon Gohsei | COPONYL™ N-2332 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. The characteristics of this product are low adherence and soft type. This product is well suited for use in adhesives for m...veja mais COPONYL™ N-2332 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. The characteristics of this product are low adherence and soft type. This product is well suited for use in adhesives for medical applications. veja menos | |
| COPONYL™ N-2584 | Nippon Gohsei | COPONYL™ N-2584 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methanol solvents. It is alkaline soluble and suitable for splicing labels and paper. This product is well suited for use in adhesi...veja mais COPONYL™ N-2584 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methanol solvents. It is alkaline soluble and suitable for splicing labels and paper. This product is well suited for use in adhesive labels and films. veja menos | |
| COPONYL™ N-3449L | Nippon Gohsei | COPONYL™ N-3449L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes and protective masking films. This produ...veja mais COPONYL™ N-3449L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes and protective masking films. This product is well suited for use in adhesives. veja menos | |
| COPONYL™ N-3483 | Nippon Gohsei | COPONYL™ N-3483 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. Applications include masking tapes and protective masking films. This product is well suited for use in adhesives. | |
| COPONYL™ N-3495HS | Nippon Gohsei | COPONYL™ N-3495HS is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes, protective masking films, double-sided...veja mais COPONYL™ N-3495HS is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides good adhesion to olefin. Applications include masking tapes, protective masking films, double-sided tapes, and foam tapes. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-3581 | Nippon Gohsei | COPONYL™ N-3581 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good wettability, and good adhesion to rough surfaces. Applications include masking tapes, protective masking films,...veja mais COPONYL™ N-3581 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good wettability, and good adhesion to rough surfaces. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-3816E | Nippon Gohsei | COPONYL™ N-3816E is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It has good durability and is suitable for optical film applications. This product is well suited for use in electronics and adhesives. | |
| COPONYL™ N-3933E | Nippon Gohsei | COPONYL™ N-3933E is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion for rounded surfaces and labels for refrigerated food. Applications include films and labels. Th...veja mais COPONYL™ N-3933E is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides good adhesion for rounded surfaces and labels for refrigerated food. Applications include films and labels. This product is well suited for use in adhesives. veja menos | |
| COPONYL™ N-4399 | Nippon Gohsei | COPONYL™ N-4399 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides slight adhesion, adhesion to rough surfaces, and is residue free. Applications include masking tapes,...veja mais COPONYL™ N-4399 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides slight adhesion, adhesion to rough surfaces, and is residue free. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-4495 | Nippon Gohsei | COPONYL™ N-4495 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics. Applications include masking tapes, protective masking films, and processin...veja mais COPONYL™ N-4495 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It provides high-speed peeling characteristics. Applications include masking tapes, protective masking films, and processing. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-4510 | Nippon Gohsei | COPONYL™ N-4510 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good repulsion resistance. Applications include double-sided tapes and foam tapes. This product is well suited for u...veja mais COPONYL™ N-4510 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and toluene solvents. It has good repulsion resistance. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-4519L | Nippon Gohsei | COPONYL™ N-4519L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides strong adhesion and high tack. Applications include masking tapes and protective masking films. This...veja mais COPONYL™ N-4519L is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and acetone solvents. It provides strong adhesion and high tack. Applications include masking tapes and protective masking films. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-6593 | Nippon Gohsei | COPONYL™ N-6593 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It has good durability and is suitable for optical film applications. This product is well suited for use in electronics and adhesives. | |
| COPONYL™ N-6803 | Nippon Gohsei | COPONYL™ N-6803 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It is formulated to provide good corrosion resistance and for use in thin-layer optical applications. This product is well suited for us...veja mais COPONYL™ N-6803 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It is formulated to provide good corrosion resistance and for use in thin-layer optical applications. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-6941 | Nippon Gohsei | COPONYL™ N-6941 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good bubble resistance, has good durability, and is ideal for thin layer application. This product is well suited for use in...veja mais COPONYL™ N-6941 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good bubble resistance, has good durability, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-7136 | Nippon Gohsei | COPONYL™ N-7136 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and methyl ethyl ketone solvents. It is acid free and ideal for optical applications. This product is well suited for use in electronics and adhe...veja mais COPONYL™ N-7136 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and methyl ethyl ketone solvents. It is acid free and ideal for optical applications. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-7166 | Nippon Gohsei | COPONYL™ N-7166 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, methyl ethyl ketone solvents. It provides good corrosion resistance, and is ideal for thin layer application. This product is well suit...veja mais COPONYL™ N-7166 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, methyl ethyl ketone solvents. It provides good corrosion resistance, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-7245 | Nippon Gohsei | COPONYL™ N-7245 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methyl ethyl ketone solvents. This product is well suited for use in electronic and adhesive applications, especially thick-layer o...veja mais COPONYL™ N-7245 is a pressure-sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate, toluene, and methyl ethyl ketone solvents. This product is well suited for use in electronic and adhesive applications, especially thick-layer optical films. veja menos | |
| COPONYL™ N-7482 | Nippon Gohsei | COPONYL™ N-7482 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for us...veja mais COPONYL™ N-7482 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good adhesion at low temperature. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-7483 | Nippon Gohsei | COPONYL™ N-7483 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good removability. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronic...veja mais COPONYL™ N-7483 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good removability. Applications include double-sided tapes and foam tapes. This product is well suited for use in electronics and adhesives. veja menos | |
| COPONYL™ N-7486 | Nippon Gohsei | COPONYL™ N-7486 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides general type adhesive properties and punching processability. Applications include films and labels. This produ...veja mais COPONYL™ N-7486 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides general type adhesive properties and punching processability. Applications include films and labels. This product is well suited for use in adhesives. veja menos | |
| COPONYL™ N-7487 | Nippon Gohsei | COPONYL™ N-7487 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides high transparency and punching processability. Applications include films and labels. This product is well suit...veja mais COPONYL™ N-7487 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate and acetone solvents. It provides high transparency and punching processability. Applications include films and labels. This product is well suited for use in adhesives. veja menos | |
| COPONYL™ N-7520 | Nippon Gohsei | COPONYL™ N-7520 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good corrosion resistance, good whitening resistance, and is ideal for thin layer application. This product is well suited f...veja mais COPONYL™ N-7520 is a pressure sensitive adhesive resin formulated from acrylic acid ester using ethyl acetate solvent. It provides good corrosion resistance, good whitening resistance, and is ideal for thin layer application. This product is well suited for use in electronics and adhesives. veja menos | |
| Crestabond® M1-04 | Scott Bader | Crestabond® M1-04 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...veja mais Crestabond® M1-04 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. veja menos | |
| Crestabond® M1-05 | Scott Bader | Crestabond® M1-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...veja mais Crestabond® M1-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. veja menos | |
| Crestabond® M1-20 | Scott Bader | Crestabond® M1-20 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...veja mais Crestabond® M1-20 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. veja menos | |
| Crestabond® M1-30 | Scott Bader | Crestabond® M1-30 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...veja mais Crestabond® M1-30 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. veja menos | |
| Crestabond® M1-60 | Scott Bader | Crestabond® M1-60 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...veja mais Crestabond® M1-60 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. veja menos | |
| Crestabond® M1-90 | Scott Bader | Crestabond® M1-90 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...veja mais Crestabond® M1-90 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. veja menos | |
| Crestabond® M7-05 | Scott Bader | Crestabond® M7-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating...veja mais Crestabond® M7-05 is a primerless two component acrylic adhesive designed for bonding composites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. veja menos | |
| Crestabond® M7-15 | Scott Bader | Crestabond® M7-15 is a primerless two component acrylic adhesive designed for bonding compoisites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstratin...veja mais Crestabond® M7-15 is a primerless two component acrylic adhesive designed for bonding compoisites, thermoplastics, and metals. This new generation of structural methacrylate adhesive meets the bonding requirements of most assembly operations, demonstrating excellent impact, peel, shear, compressive strength, and fatigue resistance properties across all bonded parts. veja menos | |
| Crestomer® 1150PA | Scott Bader | Crestomer® 1150PA is a highly thixotropic structural adhesive that is pre-accelerated and based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion and high elongation at break, shows no sagging on vertical surfaces and has good...veja mais Crestomer® 1150PA is a highly thixotropic structural adhesive that is pre-accelerated and based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion and high elongation at break, shows no sagging on vertical surfaces and has good fatigue and impact resistance properties. Crestomer® 1150PA is mostly used in structural composite applications and has good adhesion to FRP laminates, wood and some metals as well as core materials. Crestomer® 1150PA can be used for bonding diesel tanks and contour joints in FRP components. veja menos | |
| Crestomer® 1151A | Scott Bader | Crestomer® 1151A is a structural adhesive and filleting compound that is fast curing, non-sagging and bonds a variety of substrates with little surface preparation. It has a lower odor than other competing structural adhesives and is based on innovative u...veja mais Crestomer® 1151A is a structural adhesive and filleting compound that is fast curing, non-sagging and bonds a variety of substrates with little surface preparation. It has a lower odor than other competing structural adhesives and is based on innovative urethane acrylate technology. Crestomer® 1151A shows good impact strength and toughness as well as exhibiting good adhesion and gap filling properties that enables the user greater flexibility in design, saving time and money. The adhesive is especially formulated for use in bulk metering systems. veja menos | |
| Crestomer® 1152PA | Scott Bader | Crestomer® 1152PA is a two part pre-accelerated structural adhesive that is highly thixotropic and is based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion to core materials, wood, FRP laminates and some metals and because o...veja mais Crestomer® 1152PA is a two part pre-accelerated structural adhesive that is highly thixotropic and is based on unsaturated urethane acrylate in styrene monomer. It displays good adhesion to core materials, wood, FRP laminates and some metals and because of its good adhesion properties, Crestomer® 1152PA can be recommended for use as a general purpose adhesive. It can also be used to bond contour joints in FRP components, to bond diesel tanks as well as bonding damaged areas or "green" FRP. veja menos | |
| Crestomer® 1153PA | Scott Bader | Crestomer® 1153PA is a structural adhesive that is highly thixotropic and derived from unsaturated urethane acrylate in styrene monomer. The adhesive has a long open time of 90 minutes and shows good adhesion to core materials, metals, wood and FRP lamina...veja mais Crestomer® 1153PA is a structural adhesive that is highly thixotropic and derived from unsaturated urethane acrylate in styrene monomer. The adhesive has a long open time of 90 minutes and shows good adhesion to core materials, metals, wood and FRP laminates. Because of its good adhesion properties, Crestomer® 1153PA is ideal for use as a general purpose adhesive. The adhesive is also used to contour joints in FRP components, to bond "green" FRP and to build up damaged areas. Crestomer® 1153PA is mainly used in structural composite applications. veja menos | |
| Crestomer® 1186PA | Scott Bader | Crestomer® 1186PA is a structural adhesive from unique unsaturated urethane acrylate that shows resistance to crack propagation, toughness and good impact strength. It displays good adhesion to a variety of metals, polymeric materials and ceramics and off...veja mais Crestomer® 1186PA is a structural adhesive from unique unsaturated urethane acrylate that shows resistance to crack propagation, toughness and good impact strength. It displays good adhesion to a variety of metals, polymeric materials and ceramics and offers structural adhesion even when bonding FRP laminates with a 30mm thick bondline. The multi-purpose gap filling structural adhesive is used in a variety of FRP applications. veja menos | |
| Crestomer® 1196PA | Scott Bader | Crestomer® 1196PA is a low denisty core bonding structural adhesive based on unique urethane acrylate technology that displays outstanding strength and toughness. The adhesive is designed to bond core materials like balsa and rigid PVC foam to semi-cured ...veja mais Crestomer® 1196PA is a low denisty core bonding structural adhesive based on unique urethane acrylate technology that displays outstanding strength and toughness. The adhesive is designed to bond core materials like balsa and rigid PVC foam to semi-cured or cured FRP skins. It also displays a tougher and more durable structural bond than a polyester bonding adhesive or a polyester resin/glass structure. Crestomer® 1196PA also exhibits reduced styrene emissions, great weight savings and more improved cosmetics with the ridding of core print through. Crestomer® 1196PA is suited for use in sandwich construction where the needs are for a high impact-resistant, strong and tough structure. veja menos | |
| Crestomer® Advantage 30 | Scott Bader | Crestomer® Advantage 30 is a structural adhesive that is white in color and bonds with a variety of substrates with less surface preparation and a lower odor than competitive materials. It has a quick gel time of 30 minutes and bonded parts can be used in...veja mais Crestomer® Advantage 30 is a structural adhesive that is white in color and bonds with a variety of substrates with less surface preparation and a lower odor than competitive materials. It has a quick gel time of 30 minutes and bonded parts can be used in 2 hours and 20 minutes. It is based on unique urethane acrylate technology and displays good impact strength and toughness. With the strong adhesion and gap filling qualities shown by Crestomer® Advantage 30, great flexibility in design is offered, along with time and cost savings. veja menos | |
| CRYSTAZENE 110 | DRT | CRYSTAZENE 110 is a water-white, highly stabilized, terpene-modified tackifying resin. It shows excellent adhesive performances. This product is recommended for metallocene polyethylene based hot melt-synthetic rubber adhesives, acrylic based adhesives, a...veja mais CRYSTAZENE 110 is a water-white, highly stabilized, terpene-modified tackifying resin. It shows excellent adhesive performances. This product is recommended for metallocene polyethylene based hot melt-synthetic rubber adhesives, acrylic based adhesives, and for plastic film modification. veja menos | |
| Crystic® BP 621CC 30 | Scott Bader | Crystic® BP 621CC 30 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound i...veja mais Crystic® BP 621CC 30 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. veja menos | |
| Crystic® BP 621CC 45 | Scott Bader | Crystic® BP 621CC 45 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound i...veja mais Crystic® BP 621CC 45 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. veja menos | |
| Crystic® BP 621CC 65 | Scott Bader | Crystic® BP 621CC 65 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound i...veja mais Crystic® BP 621CC 65 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. veja menos | |
| Crystic® BP 621CC White 20 | Scott Bader | Crystic® BP 621CC White 20 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste with a final product colour of white. It offers high shear strength for bonded joints, eliminating the need for mechanical f...veja mais Crystic® BP 621CC White 20 is a preaccelerated, urethane acrylate- and isophthalic polyester-based, high performance bonding paste with a final product colour of white. It offers high shear strength for bonded joints, eliminating the need for mechanical fixings. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, composite constructions, and car body components. veja menos | |
| Crystic® BP 90-78PA | Scott Bader | Crystic® BP 90-78PA is a white, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assemb...veja mais Crystic® BP 90-78PA is a white, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, insert frames, ribs, and other non-structural bonding applications. veja menos | |
| Crystic® BP 90-79PA | Scott Bader | Crystic® BP 90-79PA is a grey, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assembl...veja mais Crystic® BP 90-79PA is a grey, preaccelerated, orthophthalic polyester bonding paste featuring high thixotropy, fast curing, good handling characteristics, and ease of application. This non-sagging, filled compound is specifically designed for the assembly and bonding of GRP mouldings - including panels, insert frames, ribs, and other non-structural bonding applications. veja menos | |
| Crystic® BP 90-80PA | Scott Bader | Crystic® BP 90-80PA is a pre-accelerated polyester bonding paste, consisting of a viscous, filled compound containing short glass fibers and flexible and low shrink additives. It features high shear strength, high thixotropy, and improved overall mechanic...veja mais Crystic® BP 90-80PA is a pre-accelerated polyester bonding paste, consisting of a viscous, filled compound containing short glass fibers and flexible and low shrink additives. It features high shear strength, high thixotropy, and improved overall mechanical properties. This product is specifically designed for the assembly and bonding of GRP moldings - including internal frames, inserts, ribs, panels, composite constructions, and car body components. veja menos | |
| Crystic® BP 90-82PA | Scott Bader | Crystic® BP 90-82PA is a pre-accelerated polyester bonding paste, consisting of a viscous, white, filled compound containing a flexible additive. It features high shear strength, high thixotropy, and improved impact resistance. This product is specificall...veja mais Crystic® BP 90-82PA is a pre-accelerated polyester bonding paste, consisting of a viscous, white, filled compound containing a flexible additive. It features high shear strength, high thixotropy, and improved impact resistance. This product is specifically designed for the assembly and bonding of GRP moldings - including panels, inserts, internal frames, ribs, composite constructions, and car body components. veja menos | |
| Crystic® BP 90-83PA | Scott Bader | Crystic® BP 90-83PA is a pre-accelerated orthophathlic polyester bonding paste consisting of a non-sagging, filled compound. Key features include ease of application, high thixotropy, and good handling characteristics. This product is specifically design...veja mais Crystic® BP 90-83PA is a pre-accelerated orthophathlic polyester bonding paste consisting of a non-sagging, filled compound. Key features include ease of application, high thixotropy, and good handling characteristics. This product is specifically designed for the assembly and bonding of GRP moldings, including internal frames, inserts, ribs, panels, and other non-structural bonding applications. veja menos | |
| Crystic® BP 90-83PAHV | Scott Bader | Crystic® BP 90-83PAHV is a low exotherm, preaccelerated polyester bonding paste consisting of a viscous, filled compound. It features high thixotropy, low shrink properties, good handling characteristics, and no print through. This product is specifically...veja mais Crystic® BP 90-83PAHV is a low exotherm, preaccelerated polyester bonding paste consisting of a viscous, filled compound. It features high thixotropy, low shrink properties, good handling characteristics, and no print through. This product is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, ribs, composite constructions, and car body components. veja menos | |
| Crystic® BP 90-84PA | Scott Bader | Crystic® BP 90-84PA is a lightweight, low exotherm, pre-accelerated, orthophthalic polyester bonding paste consisting of a non-sagging compound. It features high thixotropy, low specific gravity, good handling characteristics, and a visual check for effec...veja mais Crystic® BP 90-84PA is a lightweight, low exotherm, pre-accelerated, orthophthalic polyester bonding paste consisting of a non-sagging compound. It features high thixotropy, low specific gravity, good handling characteristics, and a visual check for effective catalyst mix. This product is designed for non-structural applications where gap filling may be a secondary requirement. veja menos | |
| Crystic® BP 91-21PA | Scott Bader | Crystic® BP 91-21PA is a preaccelerated isophthalic polyester bonding paste, in the form of a viscous, filled compound. Benefits include high shear strength, increased water resistance, and improved overall mechanical properties. This product is specifica...veja mais Crystic® BP 91-21PA is a preaccelerated isophthalic polyester bonding paste, in the form of a viscous, filled compound. Benefits include high shear strength, increased water resistance, and improved overall mechanical properties. This product is specifically designed for the assembly and bonding of GRP mouldings - including panels, inserts, internal frames, hull-to-deck assemblies, composite constructions, and car body components. veja menos | |
| Crystic® Scottbond 102PA White | Scott Bader | Crystic® Scottbond 102PA White is a white-colored pourable adhesive paste that is from a specially selected unsaturated polyester resin that is pre-accelerated to offer a convenient working time. The resin-based adhesive has a thixotropic polyester and is...veja mais Crystic® Scottbond 102PA White is a white-colored pourable adhesive paste that is from a specially selected unsaturated polyester resin that is pre-accelerated to offer a convenient working time. The resin-based adhesive has a thixotropic polyester and is meant for bonding GRP to rigid polyurethane foam in sandwich panel systems. Crystic® Scottbond 102PA is also used to bond GRP to plywood and plywood to polyurethane foam. It is designed to ensure ease of application and spreads easily under pressure, presenting a smoother surface in the finished product. However, it should not soak or drain too much into the polyurethane foam. Some penetration is necessary to ensure adhesion. veja menos | |
| Crystic® Scottbond 117PA | Scott Bader | Crystic® Scottbond 117PA is a high quality orthophthalic polyester resin in a gap filling adhesive paste that has been pre-accelerated to offer a convenient working time. The bonding paste is recognized as having the ability to bond most materials that a...veja mais Crystic® Scottbond 117PA is a high quality orthophthalic polyester resin in a gap filling adhesive paste that has been pre-accelerated to offer a convenient working time. The bonding paste is recognized as having the ability to bond most materials that are standard in the GRP industry. Crystic® Scottbond 117PA shows good adhesion to GRP laminates, offering a stronger bond compared to resin and glass fiber in the laminate. veja menos | |
| Crystic® Scottbond 119PA White | Scott Bader | Crystic® Scottbond 119PA White is a lightweight bonding paste with a non-sagging compound that is meant for bonding rigid PVC foam and balsa cores to make sandwich laminates. It is highly thixotropic, has low specific gravity with weight saving and good h...veja mais Crystic® Scottbond 119PA White is a lightweight bonding paste with a non-sagging compound that is meant for bonding rigid PVC foam and balsa cores to make sandwich laminates. It is highly thixotropic, has low specific gravity with weight saving and good handling properties. veja menos | |
| CV-1161 | NuSil Silicone Technology 1 | CV-1161 is a pressure sensitive silicone adhesive that retains its adhesive qualities in the presence of minor liquid and particulate contaminants. It can be used in applications that require low outgassing and minimal volatile condesable materials. This ...veja mais CV-1161 is a pressure sensitive silicone adhesive that retains its adhesive qualities in the presence of minor liquid and particulate contaminants. It can be used in applications that require low outgassing and minimal volatile condesable materials. This product is ideal for adhering and bonding silicone elastomers, metals, paper, glass, fabric organics rubbers, some synthetics, and films such as polyester or kapton. veja menos | |
| CV-1500 | NuSil Silicone Technology 1 | CV-1500 is a one part, black, electrically conductive RTV silicone adhesive/sealant that can be used for RFI and EMI shielding in electrical and space applications that require static dissipation. It can also protect components from extremes in temperatur...veja mais CV-1500 is a one part, black, electrically conductive RTV silicone adhesive/sealant that can be used for RFI and EMI shielding in electrical and space applications that require static dissipation. It can also protect components from extremes in temperature, humidity, radiation, thermal and mechanical stress. This adhesive is well suited for form-in-place conductive gaskets and attaching heating coils to solar collector plates. veja menos | |
| CV-2500 | NuSil Silicone Technology 1 | CV-2500 is a strong silicone based adhesive that is made to handle extreme conditions in space applications including condensation, humidity, radiation, and both mechanical and thermal stress. It can also be an adhesive in applications that involve solar ...veja mais CV-2500 is a strong silicone based adhesive that is made to handle extreme conditions in space applications including condensation, humidity, radiation, and both mechanical and thermal stress. It can also be an adhesive in applications that involve solar cell arrays where clarity and low volatility is needed. veja menos | |
| CV-2566 | NuSil Silicone Technology 1 | CV-2566 is a flowable silicone adhesive that has a broad operating temperature range. The primary use for this product is to be used for applications that require low outgassing and helps eliminate condensation in sensitive devices. In space and electroni...veja mais CV-2566 is a flowable silicone adhesive that has a broad operating temperature range. The primary use for this product is to be used for applications that require low outgassing and helps eliminate condensation in sensitive devices. In space and electronic applications, it can be utilized as a sealant or adhesive to help control high vacuum environments. veja menos | |
| CV-2644 | NuSil Silicone Technology 1 | CV-2644 is a two-part, tan colored electrically conductive silicone adhesive/sealant. It meets the low outgas specifications outlined by NASA and the European Space Agency so it can be used in applications that require low outgassing under extreme operati...veja mais CV-2644 is a two-part, tan colored electrically conductive silicone adhesive/sealant. It meets the low outgas specifications outlined by NASA and the European Space Agency so it can be used in applications that require low outgassing under extreme operating conditions. This product is well suited to use with form-in-place conductive gaskets. veja menos | |
| CV-2680-12 | NuSil Silicone Technology 1 | CV-2680-12 is a two-part film adhesive the cures at room temperature or rapidly with heat. It can be used for bonding or sealing silicone elastomers and some metals or plastics. This product is also ideal for applications that require shorter work times. ...veja mais CV-2680-12 is a two-part film adhesive the cures at room temperature or rapidly with heat. It can be used for bonding or sealing silicone elastomers and some metals or plastics. This product is also ideal for applications that require shorter work times. easy clean-up, and consistent bond thickness. veja menos |
