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Epokukdo YDCN-500-80PCA60 Kukdo Chemical Co., Ltd. Epokukdo YDCN-500-80PCA60 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat res...view more Epokukdo YDCN-500-80PCA60 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-80PCA60 has multi-functional groups in one molecule which are fully cross-linked excellent cured property. It means that high cross-linking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less
Epokukdo YDCN-500-80PBC60 Kukdo Chemical Co., Ltd. Epokukdo YDCN-500-80PBC60 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat res...view more Epokukdo YDCN-500-80PBC60 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-80PBC60 has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high cross-linking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less
Epokukdo YDCN-500-90PA75 Kukdo Chemical Co., Ltd. Epokukdo YDCN-500-90PA75 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resi...view more Epokukdo YDCN-500-90PA75 is derived from ocresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-90PA75 has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high cross-linking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less
Epokukdo YDCN-500-90P Kukdo Chemical Co., Ltd. Epokukdo YDCN-500-90P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resist...view more Epokukdo YDCN-500-90P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-90P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less
Epokukdo YDCN-500-80P Kukdo Chemical Co., Ltd. Epokukdo YDCN-500-80P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resist...view more Epokukdo YDCN-500-80P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a high molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-80P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less
Hanwha P-1700 Hanwha Chemical Corporation Hanwha P-1700 is a PVC resin made of a homopolymer with outstanding heat resistance. It is designed as a blend resin used to increase the physical properties of most products. It is well suited for use in the production of high strength, soft products, su...view more Hanwha P-1700 is a PVC resin made of a homopolymer with outstanding heat resistance. It is designed as a blend resin used to increase the physical properties of most products. It is well suited for use in the production of high strength, soft products, such as agricultural films, leather hoses and heat resistant wire coatings. view less
Epokukdo YDCN-500-10P Kukdo Chemical Co., Ltd. Epokukdo YDCN-500-10P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resi...view more Epokukdo YDCN-500-10P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-10P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less
Epokukdo YDCN-500-8P Kukdo Chemical Co., Ltd. Epokukdo YDCN-500-8P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resis...view more Epokukdo YDCN-500-8P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-8P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less
Epokukdo YDCN-500-7P Kukdo Chemical Co., Ltd. Epokukdo YDCN-500-7P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resis...view more Epokukdo YDCN-500-7P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a medium molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-7P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties. It means that high cross-linking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance view less
Epokukdo YDCN-500-5P Kukdo Chemical Co., Ltd. Epokukdo YDCN-500-5P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistan...view more Epokukdo YDCN-500-5P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-5P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less
Epokukdo YDCN-500-4P Kukdo Chemical Co., Ltd. Epokukdo YDCN-500-4P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistan...view more Epokukdo YDCN-500-4P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-4P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less
Epokukdo YDCN-500-1P Kukdo Chemical Co., Ltd. Epokukdo YDCN-500-1P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistan...view more Epokukdo YDCN-500-1P is derived from o-cresol novolac and has characteristics of high heat and chemical resistance. This is a low molecular type of YDCN–500 series and shows superior properties when used for molding compound for electronics, heat resistant F.R.P. and laminates, coatings for chemical resistance, and so on. YDCN-500-1P has multi-functional groups in one molecule which are fully cross-linked and offer excellent physical properties after curing. It means that high crosslinking density gives the characteristics of excellent adhesion, high heat resistance and excellent chemical resistance. view less
Epoxies® 50-3100 Epoxies, Etc. Epoxies® 50-3100 is a high thermal K heat transfer epoxy resin designed for fast and continuous heat transfer. Primarily used for the encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc....view more Epoxies® 50-3100 is a high thermal K heat transfer epoxy resin designed for fast and continuous heat transfer. Primarily used for the encapsulation of power supplies, transformers, coils, insulators, protective covering for chips, temperature probes, etc. 50-3100 measures several times faster heat dissipation than other commercially available types and can be easily mixed and poured to form a dimensionally stable heat transfer package. view less
Hanwha P-1300F Hanwha Chemical Corporation Hanwha P-1300F is a PVC resin made of a homopolymer that is designed for outstanding heat resistance. It is well suited for use in the production of high strength soft products such as agricultural films, leather hoses and wire coatings.
Epoxies® 50-3182 NC Epoxies, Etc. Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferr...view more Epoxies® 50-3182 NC is a highly filled, thermally conductive epoxy resin with excellent physical, electrical and thermal properties. It is formulated for applications where electrical insulation and mechanical protection must be maintained while transferring heat. 50-3182 NC is designed to work with a variety of catalysts to adjust additional properties including toughness, viscosity, thermal and mechanical shock values and cure times. This product is well suited for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc... view less
Epokukdo KBPN-120 Kukdo Chemical Co., Ltd. Epokukdo KBPN-120 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-120 is a small molec...view more Epokukdo KBPN-120 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-120 is a small molecular type of KBPN series and is used for the product which requires the characteristics of heat resistance, chemical resistance and low temp erature curability, high Tg for Powder Coating or Laminates. It also has high reactivity so that it is curable at ambient temperature. view less
Epokukdo KBPN-115 Kukdo Chemical Co., Ltd. Epokukdo KBPN-115 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-110 is a small molec...view more Epokukdo KBPN-115 has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional Epoxy Resin. KBPN-110 is a small molecular type of KBPN series and is used for the product which requires the characteristics of heat resistance, chemical resistance and low temp erature curability, high Tg for Powder Coating or Laminates. It also has high reactivity so that it is curable at ambient temperature. view less
Nichigo-Polyester W-0030 Nippon Gohsei Nichigo-Polyester W-0030 is a high molecular weight saturated polyester resin featuring a high acid value, good adhesion, and good heat and humidity resistance. This product is well suited for use in adhesive films and labels, plastic and electronic coati...view more Nichigo-Polyester W-0030 is a high molecular weight saturated polyester resin featuring a high acid value, good adhesion, and good heat and humidity resistance. This product is well suited for use in adhesive films and labels, plastic and electronic coatings and primers, and optical adhesives. view less
Epoxies® 50-3186 NC Epoxies, Etc. Epoxies® 50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal e...view more Epoxies® 50-3186 NC is a two part thermally conductive epoxy adhesive. This thixotropic adhesive provides high temperature bonds to a variety of substrates. 50-3186 NC is a perfect choice for applications requiring high thermal conductivity, low thermal expansion, and high operating temperature performance. view less
Epokukdo KBPN-110 Kukdo Chemical Co., Ltd. Epokukdo KBPN-110 (BPA - Novolac Epoxy) has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional epoxy resin. KBP...view more Epokukdo KBPN-110 (BPA - Novolac Epoxy) has advantageous characteristics of excellent heat, and chemical resistance, due to its multi-functional groups in a molecule. It also provides higher cross-linked property than general difunctional epoxy resin. KBPN-110 is a small molecular type of KBPN series and is used for the product which requires the characteristics of heat resistance, chemical resistance and low temp erature curability, high Tg for powder coating or laminates. It also has high reactivity so that it is curable at ambient temperature. view less
Epoxies® 50-3185 NC Epoxies, Etc. Epoxies® 50-3185 NC is a filled, thermally conductive potting and encapsulating resin with excellent physical, electrical and thermal properties. It is well suited for applications where low thermal expansion, outstanding electrical insulation and/or high...view more Epoxies® 50-3185 NC is a filled, thermally conductive potting and encapsulating resin with excellent physical, electrical and thermal properties. It is well suited for applications where low thermal expansion, outstanding electrical insulation and/or high thermal conductivity is required. 50-3185 NC is designed to work with a variety of catalysts to adjust additional properties including toughness, viscosity, thermal and mechanical shock values and cure times. This product is well suited for high voltage applications such as power supplies, transformers, high voltage insulators, bushings, etc... view less
Nichigo-Polyester WR-901 Nippon Gohsei Nichigo-Polyester WR-901 is a high molecular weight saturated polyester resin featuring good heat and humidity resistance, as well as good ultraviolet (UV) ink printability. This product is well suited for use in optical adhesives, plastic and electronic ...view more Nichigo-Polyester WR-901 is a high molecular weight saturated polyester resin featuring good heat and humidity resistance, as well as good ultraviolet (UV) ink printability. This product is well suited for use in optical adhesives, plastic and electronic coatings and primers, and adhesive films and labels. view less
Epoxies® 50-3150 FR Epoxies, Etc. Epoxies® 50-3150 is a flame retardant, thermally conductive epoxy resin that has been formulated to meet the stringent non-burning requirements of UL94 V-0. It is a black epoxy mixed with catalyst 190 and catalyst 30 and offers great heat transfer, low sh...view more Epoxies® 50-3150 is a flame retardant, thermally conductive epoxy resin that has been formulated to meet the stringent non-burning requirements of UL94 V-0. It is a black epoxy mixed with catalyst 190 and catalyst 30 and offers great heat transfer, low shrinkage, and outstanding insulation properties. Primarily used for encapsulating power supplies, transformers, coils, insulators, sensors, etc... Epoxies® 50-3150 FR is an excellent choice for applications requiring high thermal conductivity and flame retardancy. view less
Epoxies® 50-3151 NC FR Epoxies, Etc. Epoxies® 50-3151 NC FR is a low viscosity flame retardant made of a thermally conductive epoxy resin that has been developed to meet the stringent non-burning requirements of UL 94 V-0. This system offers excellent heat transfer, low shrinkage, and outsta...view more Epoxies® 50-3151 NC FR is a low viscosity flame retardant made of a thermally conductive epoxy resin that has been developed to meet the stringent non-burning requirements of UL 94 V-0. This system offers excellent heat transfer, low shrinkage, and outstanding insulation properties. Primarily used in encapsulating power supplies, transformers, coils, insulators, sensors, etc... Epoxies® 50-3151 NC FR is an excellent choice for applications requiring high thermal conductivity, flame retardancy, and low viscosity. view less
Epokukdo KB-563P Kukdo Chemical Co., Ltd. Epokukdo KB-563P is a high-brominated flameretardant epoxy oligomer resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This epoxy oligomer resin shows excellent mechanical, electrica...view more Epokukdo KB-563P is a high-brominated flameretardant epoxy oligomer resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This epoxy oligomer resin shows excellent mechanical, electrical properties, chemical resistance, molding property, heat resistance and melt flow-rate. In order to improve the flame retardancy, it can be used in engineering plastics such as ABS, HIPS, PP, PET, PC, PBT and so forth. view less
Epokukdo KB-562P Kukdo Chemical Co., Ltd. Epokukdo KB-562P is a high-brominated flame-retardant epoxy oligomer Resin using TBBA and TBP asmajor raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrica...view more Epokukdo KB-562P is a high-brominated flame-retardant epoxy oligomer Resin using TBBA and TBP asmajor raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrical properties, chemical resistance, molding property, heat resistance and melt flow-rate. In order to improve the flame retardancy, it can be used in engineering plastics such as ABS, HIPS, PP, PET, PC, PBT and so forth. view less
Epokukdo KB-560 Kukdo Chemical Co., Ltd. Epokukdo KB-560 is a high-brominated flame-retardant Epoxy oligomer Resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrica...view more Epokukdo KB-560 is a high-brominated flame-retardant Epoxy oligomer Resin using TBBA and TBP as major raw materials. It is a different type from conventional flame retardant used in the past. This Epoxy oligomer Resin shows excellent mechanical, electrical properties, chemical resistance, molding property, heat resistance and melt flow-rate. In order to improve the flame retardancy, it can be used in engineering plastics such as ABS, HIPS, PP, PET, PC, PBT and so forth. view less
Epoxies® 20-1634 Epoxies, Etc. Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent...view more Epoxies® 20-1634 is a low density, light weight, silicone potting and encapsulating compound. It utilizes an advanced micro balloon technology filler that is ideal for applications which require low weight, flexibility, high heat resistance, and excellent electrical insulation properties. 20-1634 is formulated without solvents or other toxic materials. As a result, no by-products are released during the cure process and it is safe to handle. view less
Epoxies® 20-3300 Epoxies, Etc. Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with ...view more Epoxies® 20-3300 is a two part, high temperature and thermal shock epoxy formulated to meet the most critical electronic encapsulating requirements. It has low shrinkage, high tensile and compressive strength. 20-3300 has a convenient 1:1 mix ratio with an extended pot life and has excellent adhesion to most substrates and forms a hermetic like seal to protect encapsulated parts. Well suited for high voltage applications. view less
Epoxies® 40-3909 Epoxies, Etc. Epoxies® 40-3909 is a two part epoxy resin adhesive and coating compound, filled with a highly conductive, silver coated nickel. It is designed to provide low volume resistivity of less than 5x10-3 ohm-cm. Silver coated nickel offers a lower cost alternat...view more Epoxies® 40-3909 is a two part epoxy resin adhesive and coating compound, filled with a highly conductive, silver coated nickel. It is designed to provide low volume resistivity of less than 5x10-3 ohm-cm. Silver coated nickel offers a lower cost alternative to many silver filled epoxy systems. 40-3909 has a convenient 1:1 mix ratio by weight and can cure at room temperature overnight but can also be accelerated with mild heat. It is well suited for use in the assembly or repairs of printed circuit boards, connectors, wave guides, high frequency shields, and as a cold solder. view less
Epoxies® 20-2523 Epoxies, Etc. Epoxies® 20-2523 is a black, two part, high performance polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throu...view more Epoxies® 20-2523 is a black, two part, high performance polyurethane potting and encapsulating compound that has very a very low viscosity and is ideal for use with delicate electronic components. It exhibits very low shrinkage, stress, and exotherm throughout the cure cycle. Epoxies® 20-2521 is also well known for its outstanding thermal shock and excellent dielectric properties. It is also a good choice when exposure to salt water, mild acids and bases, and aliphatic hydrocarbons is expected. view less