Sanho Chemical Co., Ltd. manufactures polyamide resins since 1973. Some of their products have applications in anti-corrosion coatings for road concrete and external building wall, spray coating for industrial machinery, automobile parts and car shell and environmental friendly waterborne coating.
Kingmide H-130 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 125-135°C. Kingmide H-130 is most commonly used in hot-melt adhesive formulation applicatio...view more
Kingmide H-130 is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 125-135°C. Kingmide H-130 is most commonly used in hot-melt adhesive formulation applications. view less
Kingmide H-130W is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2500-5000 mPa.s and a softening point of 125-135°C. Kingmide H-130W is most commonly used in hot-melt adhesive formulation applicat...view more
Kingmide H-130W is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 2500-5000 mPa.s and a softening point of 125-135°C. Kingmide H-130W is most commonly used in hot-melt adhesive formulation applications. view less
Kingmide H-135GC is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 1500-4000 mPa.s and a softening point of 130-140°C. Kingmide H-135GC is most commonly used in hot-melt adhesive formulation applic...view more
Kingmide H-135GC is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 1500-4000 mPa.s and a softening point of 130-140°C. Kingmide H-135GC is most commonly used in hot-melt adhesive formulation applications. view less
Kingmide H-140HP is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 140-150°C. Kingmide H-140HP is most commonly used in hot-melt adhesive formulation appl...view more
Kingmide H-140HP is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 140-150°C. Kingmide H-140HP is most commonly used in hot-melt adhesive formulation applications. view less
Kingmide H-170HV is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 3000-7000 mPa.s and a softening point of 165-175°C. Kingmide H-170HV is most commonly used in hot-melt adhesive formulation applic...view more
Kingmide H-170HV is a high molecular weight polyamide resin in an amber-colored pellet form. This product has a viscosity of 3000-7000 mPa.s and a softening point of 165-175°C. Kingmide H-170HV is most commonly used in hot-melt adhesive formulation applications. view less
Kingmide X-2100 is a medium viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 6000-12,000 mPa.s and a specific gravity of 1.04. Kingmide X-2100 is most commonly used in adhesive, coating, ...view more
Kingmide X-2100 is a medium viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 6000-12,000 mPa.s and a specific gravity of 1.04. Kingmide X-2100 is most commonly used in adhesive, coating, and putty formulation applications. view less
Kingmide X-220B is a low viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 450-650 mPa.s. Kingmide X-220B is most commonly used in adhesive, coating, and patch repair mortar formulation ap...view more
Kingmide X-220B is a low viscosity, modified reactive polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 450-650 mPa.s. Kingmide X-220B is most commonly used in adhesive, coating, and patch repair mortar formulation applications. view less
Kingmide X-2700 is a solvent-type modified polyaminoamide epoxy resin curing agent in a brown-colored viscous liquid form. This product has a total solids content of 68-72%. Kingmide X-2700 is most commonly used in tar-epoxy coating and enamel formulation...view more
Kingmide X-2700 is a solvent-type modified polyaminoamide epoxy resin curing agent in a brown-colored viscous liquid form. This product has a total solids content of 68-72%. Kingmide X-2700 is most commonly used in tar-epoxy coating and enamel formulation applications. view less
Thomide 423 is a polyamide-adduct type epoxy resin curing agent in a brown-colored viscous liquid form. This product has a total solids content of 58-62%. Thomide 423 is most commonly used in fast-curing paint formulation applications.
Tohmide 1310 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 1500-4500 mPa.s and a softening point of 115-125°C. Tohmide 1310 is most commonly used in hot-melt adhesive formulation applications.
Tohmide 1360 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 1500-4500 mPa.s and a softening point of 165-175°C. Tohmide 1360 is most commonly used in hot-melt adhesive formulation applications.
Tohmide 213-A is a reactive polyamide epoxy resin curing agent in a yellow-brown-colored viscous liquid form. This product has a total solids content of 48-52%. Tohmide 213-A is most commonly used in fast-curing paint formulation applications.
Tohmide 215-70X is a reactive polyamide epoxy resin curing agent in a brown-colored viscous liquid form. This product has a total solids content of 68-72%. Tohmide 215-70X is most commonly used in fast-curing paint formulation applications.
Tohmide 215-X is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 50,000-70,000 mPa.s and a specific gravity of 0.97. Tohmide 215-X is most commonly used in coating formulation applications.
Tohmide 225-R is a medium viscosity, reactive polyaminoamide in a brown-colored viscous liquid form. This product has a viscosity of 3500-10,000 mPa.s and a specific gravity of 0.97. Tohmide 225-R is most commonly used in adhesive, sealant, putty, and sur...view more
Tohmide 225-R is a medium viscosity, reactive polyaminoamide in a brown-colored viscous liquid form. This product has a viscosity of 3500-10,000 mPa.s and a specific gravity of 0.97. Tohmide 225-R is most commonly used in adhesive, sealant, putty, and surface coating formulation applications. view less
Tohmide 225-X is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-X is most commonly used in adhesive, sealant, and surface coati...view more
Tohmide 225-X is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-X is most commonly used in adhesive, sealant, and surface coating formulation applications. view less
Tohmide 225-XX is a polyaminoamide-type epoxy curing agent with a longer pot life in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-XX is most commonly used in adhesive, s...view more
Tohmide 225-XX is a polyaminoamide-type epoxy curing agent with a longer pot life in a brown-colored viscous liquid form. This product has a viscosity of 8000-12,000 mPa.s and a specific gravity of 0.97. Tohmide 225-XX is most commonly used in adhesive, sealant, and surface coating formulation applications. view less
Tohmide 235-A is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-18,000 mPa.s and a specific gravity of 0.97. TOHMIDE 235-A is most commonly used in structural adhesive and grout formul...view more
Tohmide 235-A is a polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-18,000 mPa.s and a specific gravity of 0.97. TOHMIDE 235-A is most commonly used in structural adhesive and grout formulation applications. view less
Tohmide 235-S is a medium viscosity, polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 4500-9000 mPa.s and a specific gravity of 0.97. Tohmide 235-S is most commonly used in structural adhesive ...view more
Tohmide 235-S is a medium viscosity, polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 4500-9000 mPa.s and a specific gravity of 0.97. Tohmide 235-S is most commonly used in structural adhesive and grout formulation applications. view less
Tohmide 2400 is a low viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 2500-5000 mPa.s and a specific gravity of 0.97. Tohmide 2400 is most commonly used in medium heat adhesive formulation app...view more
Tohmide 2400 is a low viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 2500-5000 mPa.s and a specific gravity of 0.97. Tohmide 2400 is most commonly used in medium heat adhesive formulation applications. view less
Tohmide 245 is a polyaminoamide-type epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1500-3000 mPa.s and a specific gravity of 0.96. Tohmide 245 is most commonly used in bonding, sealing, and resin mortar formulation app...view more
Tohmide 245 is a polyaminoamide-type epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1500-3000 mPa.s and a specific gravity of 0.96. Tohmide 245 is most commonly used in bonding, sealing, and resin mortar formulation applications. view less
Tohmide 245-HS is a very low viscosity, fatty polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 800-1100 cPs. Tohmide 245-HS is most commonly used in structural adhesive and protective coating formulation applications...view more
Tohmide 245-HS is a very low viscosity, fatty polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 800-1100 cPs. Tohmide 245-HS is most commonly used in structural adhesive and protective coating formulation applications. view less
Tohmide 245-LP is a low viscosity, polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 200-500 mPa.s and a specific gravity of 0.90. Tohmide 245-LP is most commonly used in structural adhesive and protective c...view more
Tohmide 245-LP is a low viscosity, polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 200-500 mPa.s and a specific gravity of 0.90. Tohmide 245-LP is most commonly used in structural adhesive and protective coating formulation applications. view less
Tohmide 245-S is a polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1000-2500 mPa.s and a specific gravity of 0.96. Tohmide 245-S is most commonly used in bonding, sealing, and resin mortar formulation appl...view more
Tohmide 245-S is a polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1000-2500 mPa.s and a specific gravity of 0.96. Tohmide 245-S is most commonly used in bonding, sealing, and resin mortar formulation applications. view less
Tohmide 2500 is a low viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.95. Tohmide 2500 is most commonly used in heat curing adhesive formulation appl...view more
Tohmide 2500 is a low viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.95. Tohmide 2500 is most commonly used in heat curing adhesive formulation applications. view less
Tohmide 252 is a polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 100-400 mPa.s and a specific gravity of 0.96. Tohmide 252 is most commonly used in adhesive formulation applications.
Tohmide 255 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 300-600 mPa.s and a specific gravity of 0.97. Tohmide 255 is most commonly used in reactive epoxy lining and ...view more
Tohmide 255 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 300-600 mPa.s and a specific gravity of 0.97. Tohmide 255 is most commonly used in reactive epoxy lining and thin bonding mortar formulation applications. view less
Tohmide 275 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 1200-3200 mPa.s and a specific gravity of 1.02. Tohmide 275 is most commonly used in coating and adhesive for...view more
Tohmide 275 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 1200-3200 mPa.s and a specific gravity of 1.02. Tohmide 275 is most commonly used in coating and adhesive formulation applications. view less
Tohmide 280-B is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.96. Tohmide 280-B is most commonly used in sealant and adhesive ...view more
Tohmide 280-B is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 500-1000 mPa.s and a specific gravity of 0.96. Tohmide 280-B is most commonly used in sealant and adhesive formulation applications. view less
Tohmide 390 is a solid-type polyamide resin in a brown pellet form. This product has a viscosity of 200-400 mPa.s and a softening point of 175-185°C. Tohmide 390 is most commonly used in hot-melt structural adhesive formulation applications.
Tohmide 393 is a fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 110-120°C. Tohmide 393 is most commonly used in rotogravure printing ink and varnish formulation applications.
Tohmide 394 is a solid-type fatty polyamide resin in a brown pellet form. This product has a viscosity of 500-1000 mPa.s and a softening point of 105-115°C. Tohmide 394 is most commonly used in hot-melt structural adhesive formulation applications.
Tohmide 394-N is a solid-type fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 105-115°C. Tohmide 394-N is most commonly used in rotogravure printing ink formulation applications.
Tohmide 437 is a polyamide-adduct type epoxy resin curing agent in a brown-colored viscous liquid form. This product has a total solids content of 73-77%. Tohmide 437 is most commonly used in fast-curing paint formulation applications.
Tohmide 441-A is a reactive polyamide epoxy resin curing agent in a brown-colored viscous liquid form. This product has a total solids content of 82-86%. Tohmide 441-A is most commonly used in corrosion resistant paint formulation applications.
Tohmide 558 is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-850 mPa.s and a softening point of 155-165°C. Tohmide 558 is most commonly used in structural hot-melt adhesive formulation applications.
Tohmide 558-N is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-800 mPa.s and a softening point of 155-165°C. Tohmide 558-N is most commonly used in structural hot-melt adhesive formulation applicati...view more
Tohmide 558-N is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-800 mPa.s and a softening point of 155-165°C. Tohmide 558-N is most commonly used in structural hot-melt adhesive formulation applications. view less
Tohmide 560 is a low-melting viscosity polyamide resin in a brown-colored pellet form. This product has a viscosity of 200-400 mPa.s and a softening point of 155-165°C. Tohmide 560 is most commonly used in hot-melt adhesive formulation applications.
Tohmide 90 is a fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 105-115°C. Tohmide 90 is most commonly used in rotogravure printing ink formulation applications.
Tohmide 92 is a fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 115-125°C. Tohmide 92 is most commonly used in flexographic printing ink formulation applications.
Tohmide HR-11 is a high viscosity, polyaminoamide epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-15,000 mPa.s and a specific gravity of 0.98. Tohmide HR-11 is most commonly used in adhesive formulation appl...view more
Tohmide HR-11 is a high viscosity, polyaminoamide epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 8000-15,000 mPa.s and a specific gravity of 0.98. Tohmide HR-11 is most commonly used in adhesive formulation applications. view less
Tohmide RS-640 is a high viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 10,000-14,000 mPa.s and a specific gravity of 0.96. Tohmide RS-640 is most commonly used in wood adhesive formulation a...view more
Tohmide RS-640 is a high viscosity, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 10,000-14,000 mPa.s and a specific gravity of 0.96. Tohmide RS-640 is most commonly used in wood adhesive formulation applications. view less
Tohmide TXA-254B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 3500-5500 mPa.s and a softening point of 150-160°C. Tohmide TXA-254B is most commonly used in hot-melt adhesive formulation applica...view more
Tohmide TXA-254B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 3500-5500 mPa.s and a softening point of 150-160°C. Tohmide TXA-254B is most commonly used in hot-melt adhesive formulation applications. view less
Tohmide TXA-265 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 140-150°C. Tohmide TXA-265 is most commonly used in hot-melt adhesive formulation applicati...view more
Tohmide TXA-265 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 140-150°C. Tohmide TXA-265 is most commonly used in hot-melt adhesive formulation applications. view less
Tohmide TXC-241B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 95-105°C. Tohmide TXC-241B is most commonly used in hot-melt adhesive formulation appl...view more
Tohmide TXC-241B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 95-105°C. Tohmide TXC-241B is most commonly used in hot-melt adhesive formulation applications. view less
Tohmide TXC-241F is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 105-110°C. Tohmide TXC-241F is most commonly used in hot-melt adhesive formulation app...view more
Tohmide TXC-241F is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 105-110°C. Tohmide TXC-241F is most commonly used in hot-melt adhesive formulation applications. view less
Tohmide TXC-241H is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 15,000-25,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-241H is most commonly used in hot-melt adhesive formulation app...view more
Tohmide TXC-241H is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 15,000-25,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-241H is most commonly used in hot-melt adhesive formulation applications. view less
Tohmide TXC-243A is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-243A is most commonly used in hot-melt adhesive formulation appli...view more
Tohmide TXC-243A is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-243A is most commonly used in hot-melt adhesive formulation applications. view less
Tohmide TXC-244C is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-5000 mPa.s and a softening point of 155-165°C. Tohmide TXC-244C is most commonly used in hot-melt adhesive formulation applica...view more
Tohmide TXC-244C is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-5000 mPa.s and a softening point of 155-165°C. Tohmide TXC-244C is most commonly used in hot-melt adhesive formulation applications. view less
Tohmide TXC-245A is a solid-type polyamide resin in a brown-colored pellet form. This product has a viscosity of 1000-2000 mPa.s and a softening point of 85-95°C. Tohmide TXC-245A is most commonly used in heat transfer ink formulation applications.
Tohmide TXC-269 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 3000-4000 mPa.s and a softening point of 170-180°C. Tohmide TXC-269 is most commonly used in hot-melt low-pressure molding adhesive formulation applicatio...view more
Tohmide TXC-269 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 3000-4000 mPa.s and a softening point of 170-180°C. Tohmide TXC-269 is most commonly used in hot-melt low-pressure molding adhesive formulation applications. view less
Tohmide TXC-271 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 500-1200 mPa.s and a softening point of 141-153°C. Tohmide TXC-271 is most commonly used in hot-melt low-pressure molding adhesive formulation application...view more
Tohmide TXC-271 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 500-1200 mPa.s and a softening point of 141-153°C. Tohmide TXC-271 is most commonly used in hot-melt low-pressure molding adhesive formulation applications. view less
Tohmide TXH-674B is a modified polyaminoamide hardener in an amber liquid form. This product has a viscosity of 10,000-20,000 mPa.s and a specific gravity of 1.11. Tohmide TXH-674B is most commonly used in concrete coating formulation applications.
Tohmide TXS-53C is a self-emulsifiable epoxy curing agent in a yellow-brown liquid form. This product has a viscosity of 3000-12,500 mPa.s. Tohmide TXS-53C is most commonly used in concrete primer formulation applications.
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