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BYK-1641 BYK BYK-1641 is a VOC- and mineral oil-free defoamer for aqueous systems that is very easy to incorporate and has an excellent price-performance ratio.
BYK-1745 BYK BYK-1745 is a VOC- and silicone-free defoamer based on polymers and renewable as well as sustainable raw materials for aqueous adhesives and aqueous architectural coatings.
BYK-3568 BYK BYK-3568 is a surface-active additive to improve leveling and increase the surface energy of solvent-borne, 100 %, and UV systems, with a medium reduction in surface tension and a medium increase in surface slip.
Kingcure 800-C Sanho Chemical Co., Ltd. Kingcure 800-C is a mercaptan terminated polymer in a light yellow-colored liquid form. This product has a viscosity of 10,000-20,000 mPa.s. Kingcure 800-C is most commonly used in construction adhesive formulation applications.
Kingcure 800-F Sanho Chemical Co., Ltd. Kingcure 800-F is a mercaptan terminated polymer in a light yellow-colored liquid form. This product has a slower gel time and a viscosity of 10,000-20,000 mPa.s. Kingcure 800-F is most commonly used in construction adhesive formulation applications.
RHEOBYK-100 BYK RHEOBYK-100 is a powdered rheology additive for non-polar to medium-polarity solvent-borne systems. It is suitable for many systems based on aliphatic through to aromatic solvents. It can therefore be used in protective coatings, architectural coatings an...view more RHEOBYK-100 is a powdered rheology additive for non-polar to medium-polarity solvent-borne systems. It is suitable for many systems based on aliphatic through to aromatic solvents. It can therefore be used in protective coatings, architectural coatings and general industrial coatings. RHEOBYK-100 is also particularly suitable for use in thick-layered epoxy and vinyl resin systems. view less
Tohmide 235-S Sanho Chemical Co., Ltd. Tohmide 235-S is a medium viscosity, polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 4500-9000 mPa.s and a specific gravity of 0.97. Tohmide 235-S is most commonly used in structural adhesive ...view more Tohmide 235-S is a medium viscosity, polyaminoamide-type epoxy curing agent in a brown-colored viscous liquid form. This product has a viscosity of 4500-9000 mPa.s and a specific gravity of 0.97. Tohmide 235-S is most commonly used in structural adhesive and grout formulation applications. view less
Tohmide 245 Sanho Chemical Co., Ltd. Tohmide 245 is a polyaminoamide-type epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1500-3000 mPa.s and a specific gravity of 0.96. Tohmide 245 is most commonly used in bonding, sealing, and resin mortar formulation app...view more Tohmide 245 is a polyaminoamide-type epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1500-3000 mPa.s and a specific gravity of 0.96. Tohmide 245 is most commonly used in bonding, sealing, and resin mortar formulation applications. view less
Tohmide 245-S Sanho Chemical Co., Ltd. Tohmide 245-S is a polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1000-2500 mPa.s and a specific gravity of 0.96. Tohmide 245-S is most commonly used in bonding, sealing, and resin mortar formulation appl...view more Tohmide 245-S is a polyaminoamide epoxy curing agent in a brown-colored liquid form. This product has a viscosity of 1000-2500 mPa.s and a specific gravity of 0.96. Tohmide 245-S is most commonly used in bonding, sealing, and resin mortar formulation applications. view less
Tohmide 255 Sanho Chemical Co., Ltd. Tohmide 255 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 300-600 mPa.s and a specific gravity of 0.97. Tohmide 255 is most commonly used in reactive epoxy lining and ...view more Tohmide 255 is a low viscosity, fast setting, reactive polyamide hardener in a brown-colored viscous liquid form. This product has a viscosity of 300-600 mPa.s and a specific gravity of 0.97. Tohmide 255 is most commonly used in reactive epoxy lining and thin bonding mortar formulation applications. view less