| Methyl Propanediol | Perstorp | Methyl Propanediol is a clear colorless liquid that is used in saturated and unsaturated polyesters for powder coatings, coil coatings and other stoving enamels. | |
| Resiflow® L-210 | Estron Chemical, Inc. | Resiflow® L-210 is a low viscosity, non-reactive acrylic polymer used as a leveling agent in high solids, UV curing, coil, and other coating systems. Resiflow® L-210 can also facilitate air release and minimize surface imperfections such as pinholes and c...view more Resiflow® L-210 is a low viscosity, non-reactive acrylic polymer used as a leveling agent in high solids, UV curing, coil, and other coating systems. Resiflow® L-210 can also facilitate air release and minimize surface imperfections such as pinholes and craters. Resiflow® L-210 has compatibility with all coating systems including acrylic, alkyd, phenolic, epoxy, polyester, polyurethane, nitrocellulose lacquer, and other systems. view less | |
| Resiflow® L-3075 | Estron Chemical, Inc. | Resiflow® L-3075 is a specialty acrylic polymer additive provided at 75% solids in Solvent 100 (Hi-Sol 10) for use in coil coating systems. The recommended level of usage is between 0.2-2.0% based on coating resin weight. Resiflow® L-3075 affords excellen...view more Resiflow® L-3075 is a specialty acrylic polymer additive provided at 75% solids in Solvent 100 (Hi-Sol 10) for use in coil coating systems. The recommended level of usage is between 0.2-2.0% based on coating resin weight. Resiflow® L-3075 affords excellent air release, improved film characteristics, and resistance to dirt-pick up. view less | |
| Resiflow® S | Estron Chemical, Inc. | Resiflow® S is an acrylic polymer cut 50% in Solvent 100 (Hi-Sol 10) used primarily as a flow and leveling agent. Resiflow® S should not negatively affect intercoat or recoat adhesion. The recommended level of usage is between 0.4 – 3% based on the binder...view more Resiflow® S is an acrylic polymer cut 50% in Solvent 100 (Hi-Sol 10) used primarily as a flow and leveling agent. Resiflow® S should not negatively affect intercoat or recoat adhesion. The recommended level of usage is between 0.4 – 3% based on the binder content. Resiflow® S is suitable for solvent borne coatings including primers and coil coatings. view less |
