| RILSAN® D80 NAT | Arkema | RILSAN® D80 NAT is a 100% bio-based polyamide 11 used to texture all kinds of coatings, varnishes, or ink in addition to improving abrasion and scratch resistance. This polyamide-11 powder provides anti-slip properties. The low oil absorption makes it su...view more RILSAN® D80 NAT is a 100% bio-based polyamide 11 used to texture all kinds of coatings, varnishes, or ink in addition to improving abrasion and scratch resistance. This polyamide-11 powder provides anti-slip properties. The low oil absorption makes it suitable in waterborne, solvent-borne, or solvent-free technology with reduced impact on rheology. The melting point temperature is 186°C. The average diameter of 95-105µm. view less | Request Sample |
| SCABA | PCI Group, Inc. | SCABA is a light amber reactive polyamide resin solution that is intended to increase viscosity and improve sag resistance for pigmented systems. It can be used in acid-catalyzed, alkyds (short, medium and long oils), epoxy, epoxy ester, polyurethane and ...view more SCABA is a light amber reactive polyamide resin solution that is intended to increase viscosity and improve sag resistance for pigmented systems. It can be used in acid-catalyzed, alkyds (short, medium and long oils), epoxy, epoxy ester, polyurethane and polyester. view less | |
| SP-115 | Macro Polymers Pvt. Ltd. | SP-115 is a polyamide resin. This product should be used in combination with epoxy coatings as a hardener. It can be used in cold-curing, solvent-based coatings for good adhesion, flexibility, and anti-corrosion protection. | |
| SP-125 | Macro Polymers Pvt. Ltd. | SP-125 is a polyamide resin. This product should be used in combination with epoxy coatings as a hardener, in order to induce good adhesion, flexibility, and anti-corrosion protection. It can be used in cold-curing, solvent-containing coatings for steel...view more SP-125 is a polyamide resin. This product should be used in combination with epoxy coatings as a hardener, in order to induce good adhesion, flexibility, and anti-corrosion protection. It can be used in cold-curing, solvent-containing coatings for steel and mineral substrates, and in coatings for paints and adhesives. view less | |
| SP-140 | Macro Polymers Pvt. Ltd. | SP-140 is a polyamide resin. This product should be used in combination with an epoxy coating as a hardener, in order to induce good adhesion, flexibility, and anti-corrosion protections. It can be used in cold-curing, solvent-containing coatings for st...view more SP-140 is a polyamide resin. This product should be used in combination with an epoxy coating as a hardener, in order to induce good adhesion, flexibility, and anti-corrosion protections. It can be used in cold-curing, solvent-containing coatings for steel and mineral substrates, and in construction coatings. view less | |
| SP-160 | Macro Polymers Pvt. Ltd. | SP-160 is a polyamide resin. This product should be used in combination with an epoxy coating as a hardener, in order to induce good adhesion, flexibility, and anti-corrosion protection. It can be used in cold-curing, solvent-containing coatings for ste...view more SP-160 is a polyamide resin. This product should be used in combination with an epoxy coating as a hardener, in order to induce good adhesion, flexibility, and anti-corrosion protection. It can be used in cold-curing, solvent-containing coatings for steel and mineral substrates, and in construction coatings. view less | |
| Tohmide 1310 | Sanho Chemical Co., Ltd. | Tohmide 1310 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 1500-4500 mPa.s and a softening point of 115-125°C. Tohmide 1310 is most commonly used in hot-melt adhesive formulation applications. | |
| Tohmide 1360 | Sanho Chemical Co., Ltd. | Tohmide 1360 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 1500-4500 mPa.s and a softening point of 165-175°C. Tohmide 1360 is most commonly used in hot-melt adhesive formulation applications. | |
| Tohmide 225-R | Sanho Chemical Co., Ltd. | Tohmide 225-R is a medium viscosity, reactive polyaminoamide in a brown-colored viscous liquid form. This product has a viscosity of 3500-10,000 mPa.s and a specific gravity of 0.97. Tohmide 225-R is most commonly used in adhesive, sealant, putty, and sur...view more Tohmide 225-R is a medium viscosity, reactive polyaminoamide in a brown-colored viscous liquid form. This product has a viscosity of 3500-10,000 mPa.s and a specific gravity of 0.97. Tohmide 225-R is most commonly used in adhesive, sealant, putty, and surface coating formulation applications. view less | |
| Tohmide 245-HS | Sanho Chemical Co., Ltd. | Tohmide 245-HS is a very low viscosity, fatty polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 800-1100 cPs. Tohmide 245-HS is most commonly used in structural adhesive and protective coating formulation applications...view more Tohmide 245-HS is a very low viscosity, fatty polyamide resin in a brown-colored viscous liquid form. This product has a viscosity of 800-1100 cPs. Tohmide 245-HS is most commonly used in structural adhesive and protective coating formulation applications. view less | |
| Tohmide 390 | Sanho Chemical Co., Ltd. | Tohmide 390 is a solid-type polyamide resin in a brown pellet form. This product has a viscosity of 200-400 mPa.s and a softening point of 175-185°C. Tohmide 390 is most commonly used in hot-melt structural adhesive formulation applications. | |
| Tohmide 393 | Sanho Chemical Co., Ltd. | Tohmide 393 is a fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 110-120°C. Tohmide 393 is most commonly used in rotogravure printing ink and varnish formulation applications. | |
| Tohmide 394 | Sanho Chemical Co., Ltd. | Tohmide 394 is a solid-type fatty polyamide resin in a brown pellet form. This product has a viscosity of 500-1000 mPa.s and a softening point of 105-115°C. Tohmide 394 is most commonly used in hot-melt structural adhesive formulation applications. | |
| Tohmide 394-N | Sanho Chemical Co., Ltd. | Tohmide 394-N is a solid-type fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 105-115°C. Tohmide 394-N is most commonly used in rotogravure printing ink formulation applications. | |
| Tohmide 558 | Sanho Chemical Co., Ltd. | Tohmide 558 is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-850 mPa.s and a softening point of 155-165°C. Tohmide 558 is most commonly used in structural hot-melt adhesive formulation applications. | |
| Tohmide 558-N | Sanho Chemical Co., Ltd. | Tohmide 558-N is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-800 mPa.s and a softening point of 155-165°C. Tohmide 558-N is most commonly used in structural hot-melt adhesive formulation applicati...view more Tohmide 558-N is a solid-type fatty polyamide resin in a brown-colored pellet form. This product has a viscosity of 300-800 mPa.s and a softening point of 155-165°C. Tohmide 558-N is most commonly used in structural hot-melt adhesive formulation applications. view less | |
| Tohmide 560 | Sanho Chemical Co., Ltd. | Tohmide 560 is a low-melting viscosity polyamide resin in a brown-colored pellet form. This product has a viscosity of 200-400 mPa.s and a softening point of 155-165°C. Tohmide 560 is most commonly used in hot-melt adhesive formulation applications. | |
| Tohmide 90 | Sanho Chemical Co., Ltd. | Tohmide 90 is a fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 105-115°C. Tohmide 90 is most commonly used in rotogravure printing ink formulation applications. | |
| Tohmide 92 | Sanho Chemical Co., Ltd. | Tohmide 92 is a fatty polyamide resin in a brown-yellow pellet form. This product has a softening point of 115-125°C. Tohmide 92 is most commonly used in flexographic printing ink formulation applications. | |
| Tohmide TXA-254B | Sanho Chemical Co., Ltd. | Tohmide TXA-254B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 3500-5500 mPa.s and a softening point of 150-160°C. Tohmide TXA-254B is most commonly used in hot-melt adhesive formulation applica...view more Tohmide TXA-254B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 3500-5500 mPa.s and a softening point of 150-160°C. Tohmide TXA-254B is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXA-265 | Sanho Chemical Co., Ltd. | Tohmide TXA-265 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 140-150°C. Tohmide TXA-265 is most commonly used in hot-melt adhesive formulation applicati...view more Tohmide TXA-265 is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-4000 mPa.s and a softening point of 140-150°C. Tohmide TXA-265 is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-241B | Sanho Chemical Co., Ltd. | Tohmide TXC-241B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 95-105°C. Tohmide TXC-241B is most commonly used in hot-melt adhesive formulation appl...view more Tohmide TXC-241B is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 95-105°C. Tohmide TXC-241B is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-241F | Sanho Chemical Co., Ltd. | Tohmide TXC-241F is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 105-110°C. Tohmide TXC-241F is most commonly used in hot-melt adhesive formulation app...view more Tohmide TXC-241F is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 11,000-20,000 mPa.s and a softening point of 105-110°C. Tohmide TXC-241F is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-241H | Sanho Chemical Co., Ltd. | Tohmide TXC-241H is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 15,000-25,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-241H is most commonly used in hot-melt adhesive formulation app...view more Tohmide TXC-241H is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 15,000-25,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-241H is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-243A | Sanho Chemical Co., Ltd. | Tohmide TXC-243A is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-243A is most commonly used in hot-melt adhesive formulation appli...view more Tohmide TXC-243A is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 5000-10,000 mPa.s and a softening point of 100-110°C. Tohmide TXC-243A is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-244C | Sanho Chemical Co., Ltd. | Tohmide TXC-244C is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-5000 mPa.s and a softening point of 155-165°C. Tohmide TXC-244C is most commonly used in hot-melt adhesive formulation applica...view more Tohmide TXC-244C is a high molecular weight polyamide resin in a brown-colored pellet form. This product has a viscosity of 2000-5000 mPa.s and a softening point of 155-165°C. Tohmide TXC-244C is most commonly used in hot-melt adhesive formulation applications. view less | |
| Tohmide TXC-245A | Sanho Chemical Co., Ltd. | Tohmide TXC-245A is a solid-type polyamide resin in a brown-colored pellet form. This product has a viscosity of 1000-2000 mPa.s and a softening point of 85-95°C. Tohmide TXC-245A is most commonly used in heat transfer ink formulation applications. | |
| Tohmide TXC-269 | Sanho Chemical Co., Ltd. | Tohmide TXC-269 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 3000-4000 mPa.s and a softening point of 170-180°C. Tohmide TXC-269 is most commonly used in hot-melt low-pressure molding adhesive formulation applicatio...view more Tohmide TXC-269 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 3000-4000 mPa.s and a softening point of 170-180°C. Tohmide TXC-269 is most commonly used in hot-melt low-pressure molding adhesive formulation applications. view less | |
| Tohmide TXC-271 | Sanho Chemical Co., Ltd. | Tohmide TXC-271 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 500-1200 mPa.s and a softening point of 141-153°C. Tohmide TXC-271 is most commonly used in hot-melt low-pressure molding adhesive formulation application...view more Tohmide TXC-271 is a polyamide resin in a brown-colored pellet form. This product has a viscosity of 500-1200 mPa.s and a softening point of 141-153°C. Tohmide TXC-271 is most commonly used in hot-melt low-pressure molding adhesive formulation applications. view less | |
| Versamid® 100 | Gabriel Performance Products | Versamid® 100 is a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 and epoxy resin systems provide long pot lives and fast tack-free formulatio...view more Versamid® 100 is a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 and epoxy resin systems provide long pot lives and fast tack-free formulations. Formulations based on this resin system cure less quickly than Versamid® 115 systems and exhibit somewhat lower chemical and solvent resistance than Versamid® 125 coating systems. Versamid® 100 and epoxy resin systems are recommended for applications such as: Maintenance coating applications, primers, and enamel paint formulations. view less | |
| Versamid® 100 I-70 | Gabriel Performance Products | Versamid® 100 I-70 is an iso-propanol solution of a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 I-70 and epoxy resin systems provide long ...view more Versamid® 100 I-70 is an iso-propanol solution of a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 I-70 and epoxy resin systems provide long pot lives and fast tack-free formulations. Formulations based on this resin system cure less quickly than Versamid® 115 systems and exhibit somewhat lower chemical and solvent resistance than Versamid® 125 coating systems. view less | |
| Versamid® 100 T-60 | Gabriel Performance Products | Versamid® 100 T-60 is a toluene solution of a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 T-60 and epoxy resin systems provide long pot liv...view more Versamid® 100 T-60 is a toluene solution of a semi-solid, reactive polyamide resin designed for use with solid or liquid epoxy resins for room temperature cure thermoset coating applications. Versamid® 100 T-60 and epoxy resin systems provide long pot lives and fast tack-free formulations. Formulations based on this resin system cure less quickly than Versamid® 115 systems and exhibit somewhat lower chemical and solvent resistance than Versamid® 125 coating systems. view less | |
| Versamid® 115 | Gabriel Performance Products | Versamid® 115 is a high viscosity, reactive polyamide resin designed for use with solid or liquid epoxy resins for flexible and resistant thermoset coating applications that cure at room temperature. This resin is also useful in adhesive applications. Ver...view more Versamid® 115 is a high viscosity, reactive polyamide resin designed for use with solid or liquid epoxy resins for flexible and resistant thermoset coating applications that cure at room temperature. This resin is also useful in adhesive applications. Versamid® 115 and epoxy resin systems provide excellent resistance properties, adhesion and superior corrosion resistance. They are more solvent and chemical resistant than Versamid® 100 systems and generally dry faster than Versamid® 125 systems. Versamid® 115 and epoxy resin systems are recommended for applications such as: Maintenance coating applications, Primers, and Enamel paint formulations. view less | |
| Versamid® 125 | Gabriel Performance Products | Versamid® 125 is a medium viscosity, reactive polyamide resin designed for use with solid or liquid epoxy resins for tough, chemical-resistant thermoset coating applications that cure at room temperature. This resin is also useful in adhesive applications...view more Versamid® 125 is a medium viscosity, reactive polyamide resin designed for use with solid or liquid epoxy resins for tough, chemical-resistant thermoset coating applications that cure at room temperature. This resin is also useful in adhesive applications. Versamid® 125 and epoxy resin systems are generally harder than and cure more rapidly than Versamid® 140 systems. It is often blended with Versamid® G 250 US, a fatty amido amine resin, to provide a range of viscosities, cure speeds and resistance properties. view less | |
| Versamid® 140 | Gabriel Performance Products | Versamid® 140 is a medium to low viscosity, reactive polyamide resin solution designed for use with solid or liquid epoxy resins to provide tough, chemical-resistant thermoset coating applications that cure at room temperature. This resin is also useful i...view more Versamid® 140 is a medium to low viscosity, reactive polyamide resin solution designed for use with solid or liquid epoxy resins to provide tough, chemical-resistant thermoset coating applications that cure at room temperature. This resin is also useful in adhesive applications. Versamid® 140 and epoxy resin coating systems are more chemical and solvent resistant than Versamid® 115 systems and generally lower in viscosity than Versamid® 125 systems. It offers a unique combination of hardness and flexibility along with the highest chemical and solvent resistance of the dimer-based polyamide resin series. view less | |
| Versamid® 228 | Gabriel Performance Products | Versamid® 228 is a modified polyamide/epoxy adduct designed for reactions with low viscosity liquid epoxy resins. Versamid® 228 and epoxy resin systems are recommended for applications such as industrial maintenance coating applications, primers, and enam...view more Versamid® 228 is a modified polyamide/epoxy adduct designed for reactions with low viscosity liquid epoxy resins. Versamid® 228 and epoxy resin systems are recommended for applications such as industrial maintenance coating applications, primers, and enamel paint formulations. view less | |
| Versamid® C-30 | Gabriel Performance Products | Versamid® C-30 is a low viscosity, light colored, amine curing agent that is moisture insensitive at room temperature. It has been designed specifically for use in high solids coatings, self-leveling flooring and castings where excellent chemical resistan...view more Versamid® C-30 is a low viscosity, light colored, amine curing agent that is moisture insensitive at room temperature. It has been designed specifically for use in high solids coatings, self-leveling flooring and castings where excellent chemical resistance, good color retention and excellent flow and blush resistance are required. view less | |
| Versamid® EH-30 | Gabriel Performance Products | Versamid® EH-30 is a tertiary amine accelerator and curing agent for epoxy resin systems. The anionic catalyst is a Lewis base that contains unshared electrons to facilitate opening the oxirane ring. Versamid® EH-30, a Mannich base, shows marked accelerat...view more Versamid® EH-30 is a tertiary amine accelerator and curing agent for epoxy resin systems. The anionic catalyst is a Lewis base that contains unshared electrons to facilitate opening the oxirane ring. Versamid® EH-30, a Mannich base, shows marked acceleration because of the presence of the phenolic hydroxyl. view less | |
| Versamid® G-151 | Gabriel Performance Products | Versamid® G-151 is an amidoamine resin of low viscosity suitable for catalyzing both liquid and solid epoxy. It offers the same advantages as other types of amino-amides, however, Versamid® G-151 has a lower sensitivity to humidity. | |
| Versamid® G-490 | Gabriel Performance Products | Versamid® G-490 is a liquid amidoamine resin designed for reaction with liquid or solid epoxy resins. It can be used as all or part of the curing agent component in high solids, adhesive, sealant, electrical potting, coating and flooring applications. |
